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A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Nordson ASYMTEK: S-822 with dual-action DV-8000s - Chip Encapsulation

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Main Office

2747 Loker Ave. West
Carlsbad, California, 92010
United States

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  • BGA Rework (Top side heat only!)
  • grauen06  3/28/2015 4 posts
    I was handed the task to develop a process to solder a BGA using topside heat only. It is a long story so I will spare the details, but I was wondering if anyone has ever attempted this? I have been going at it for a few weeks with fair results, but the process window seems very tight. Also, what is a good test to verify good solder connection on the BGA? Is there a simple one?
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