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Essemtec is a worldwide leader in manufacturing of highly flexible Surface Mount Technology (SMT) production equipment - pick-and-place system, dispenser, printer, oven, storage system and software Solutions.

3-in-1 combined process - jetting of solder paste and/or glue and SMD assembly by Essemtec HD

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Main Office

Mosenstrasse 20 CH-6287
Aesch, ZH 6287

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  • Adriano  3/06/2015 4 posts
    Hi, I have faced some problems with DQFN PACKAGE 132 PIN. After some cross sections and dye pry analysis we could find a head on pillow situation always on inner row pads. The PCBAs are double side and the DQFNs are assembled on Bottom side (Notebook PCBA). The PCB DQFN pads are NSMD. We have tried at least 5 different stencils designs and many reflow profiles (the current one has the PWI lower than 50%). If we follow the exact supplier stencil opening recomendation, situation gets worst.
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