Hi All,
Anybody knows what is the minimum clearance between through hole component and chip component?
Problem description:
On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole of through hole component (which is mounted from top side). Bottom side is Wave soldered. But during soldering bridging effect occurs between the through hole component and one of the chip component. It seems, that distance between this two components is not big enough. Is any document which specify the minimum distance between different components?
Any additional data which may be helpful:
The pcb is 1.6 mm thick The through hole diameter is 1mm (hole) and 2 mm (whole diameter of the pad) Distance between edges of the through hole pad and chip pad is 0.5 mm.
If the clearance is ok, have anybody an idea what can be wrong with the wave process?
Thank you very much in advance for any information regarding this issue.
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