| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether my temp chamber can provide the ramp needed to properly stress the solder bonds. Anyone out there gone through this practice? | Temp ramp tests may not be enough to completly test the joint reliability, you may consider Vibration testing also, I am working with Hobbs Engineering to test some new designs for our fish finders. Contact them at 1-303-465-5988 | Hope this helps | Mike
I certainly agree with all required testing as thermal stress, thermal shock, mechanical (as vibration and shock), environmental, and electrical. Start with x-ray analysis of solder joints. If volume exceeds 20% you must proceed with all other testing. Also, you must be aware, and have control of, solder process management. If not, all factors will produce defects. Earl Moon
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