I have recently encountered a new pcb design with a very high density of components on either side of the pcb.
One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad.
My concern is solder leaching creating solder beads/un-soldered joints post reflow.
I have experience of intrusive reflow and suitable stencil design but am unsure of the impact of simply drilling holes through pcbs to free up real estate.
Has anybody experieced a similar issue, and produced IPC class 2 pcb assemblies using this idea or is it just a no go?
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