DCA/Wire Bonding/Encapsulation

Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding?

- What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die? - Considerations: fast cure time, etc. - What Wire Bonding Machine and brand of encapsulant used to encapsulate the wire bonds do you recommend?

Thanks an advance for any help.

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