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Technical Library articles |
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Digital manufacturing for traceability: The way to higher product quality and better warranty management
Published: |
Aug 26, 2010 |
Author: |
Siemens PLM Software |
Company: |
Siemens Electronics Assembly Systems Inc.
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Abstract: |
Driven by high-profile regulations compliance like the TREAD Act, warranty management has become a hot
topic across industries worldwide.... |
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Implementation challenges for PCB tracking using RFID
Published: |
Aug 26, 2010 |
Author: |
Murata |
Company: |
Murata Electronics
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Abstract: |
Radio frequency identification (RFID) ICs are a popular alternative to barcodes for PCB tracking applications. This article outlines some of the challenges that may be encountered when implementing an RFID system... |
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AdvancedCMT vs. Pressfit. The advantages of the Compression Mount Technology (CMT) when using AdvancedTCA and MicroTCA connectors.
Published: |
Aug 26, 2010 |
Author: |
CODICO GmbH, Yamaichi Electronics |
Company: |
Yamaichi Electronics
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Abstract: |
The advantages of the Compression Mount
Technology (CMT) when using AdvancedTCA and MicroTCA connectors.... |
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Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications
Published: |
Aug 19, 2010 |
Author: |
Dong Zhang, Meg Tredinnick, Mark Challingsworth |
Company: |
Heraeus
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Abstract: |
The silver end termination plays an important role for multilayer chip inductors. A basic
requirement is to achieve excellent electrical properties with superior adhesion to the chip.
Driven by the increasing price of silver, interest has been shown to ... |
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Realistic Implementation of Signal Integrity Screening – Guidelines for PCB Designers
Published: |
Aug 19, 2010 |
Author: |
Griff Derryberry |
Company: |
Zuken
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Abstract: |
This article looks at each of the roles of the engineer and PCB designer, considers the traditional design process, and makes suggestions on how the designer can contribute significantly to improving a design’s overall signal integrity while simultaneousl... |
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PWB Manufacturing Variability Effects on High Speed SerDes Links: Statistical Insights from Thousands of 4-Port SParameter Measurements
Published: |
Aug 05, 2010 |
Author: |
Bart O. McCoy, Robert Techentin, Benjamin Buhrow, Kevin Buchs, Dr. Barry K. Gilbert, Dr. Erik S. Daniel, How Lin |
Company: |
Endicott Interconnect Technologies
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Abstract: |
Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring
boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability estimates of SI me... |
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01005 Production Goes Industry Wide
Published: |
Jul 29, 2010 |
Author: |
Satoshi Kataoka, Eric Klaver |
Company: |
Assembl�on Netherlands B.V.
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Abstract: |
The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components’ miniature size made them difficult to see, let alone place reliably with high accuracy. Designers were reluctant to... |
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THT in-line Inspection: Contradiction or greater Efficiency?
Published: |
Jul 22, 2010 |
Author: |
Jens Kokott |
Company: |
GOEPEL electronic
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Abstract: |
The utilisation of Automated Optical Inspection systems has become an integral part in quality assurance of electronic assemblies. Depending on batch size and product mixture, AOI systems as Inline integration or as a stand-alone solution benefit efficien... |
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A New Stenciling Method for Reworking SMT Components
Published: |
Jul 15, 2010 |
Author: |
Bob Wettermann |
Company: |
BEST Inc
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Abstract: |
When reworking more complex SMT components such as finer pitch SMT components, SMTconnectors and even area array devices, the most common method of printing on the printing selectively on the PCB has some serious shortcomings. The most significant problem... |
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Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder
Published: |
Jul 08, 2010 |
Author: |
T. Ryno, A. Kelley, J. Metzger, D. Medlin, C. Voyles, S. Richards |
Company: |
Radiance Technologies
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Abstract: |
As technology becomes increasingly reliant on electronics, understanding the reliability
of lead-free solder also becomes increasingly important. This research project focused on phase
transformation kinetics with the lead-free solder SAC 305. Today in ... |
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