May 10, 2012

Cherie Chen, Jeffrey ChangBing Lee, Graver Chang, Jandel Lin, Casa Hsieh, Jesse Liao, Jerry Huang

Integrated Service Technology (IST)

First published in the 2012 IPC APEX EXPO technical conference proceedings. Creep corrosion normally happens in the end system, PCB, connectors and components are widely noted due to the exposure of high sulfur environments under elevated humidity. In thi...

May 03, 2012

Anthony J. Suto

Teradyne

First published in the 2012 IPC APEX EXPO technical conference proceedings. Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled, un-powered, vec...

Apr 26, 2012

Paul Reid

PWB Interconnect Solutions Inc.

First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva...

Apr 19, 2012

Michael Ford, Valor Division of Mentor Graphics Corp.

Mentor Graphics

Presented at IPC Apex 2012. Working through the New Product Introduction (NPI) flow between product design and manufacturing is usually a challenging process, with both parties being experts in their own fields and inextricably linked in the flow of g...

Apr 12, 2012

Robert Dervaes, V.P. Technology

FCT ASSEMBLY, INC.

Surface mount technology (SMT) started in the 1960s and became more common in the 1980s. It is the dominant technology in use today. Through-hole technology is still in use, and will be for the foreseeable future, but the drive towards miniaturization of ...

Apr 09, 2012

FCT Assembly

FCT ASSEMBLY, INC.

As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasi...

Apr 05, 2012

L.G. Barajas, A. Kansal, A. Saxena, M. Egerstedt, A. Goldstein, E.W. Kamen

Georgia Institute of Technology

In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob...

Mar 22, 2012

Raymond G. Clark, Joseph D. Poole, TT Electronics - IMS

TT Electronics

Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ha...

Mar 15, 2012

Nagesh Gupta

Cadence Design Systems, Inc.

Increases in field-programmable gate array (FPGA) capabilities, combined with growing system complexity, have created many FPGA-based system design challenges. One key challenge is choosing the right FPGA for the design needs, and maximizing the use of FP...

Mar 15, 2012

Bernd Krauss, Turck-Duotec, Grünhain-Beierfeld, Jürgen Friedrich

ASYS Group Americas Inc.

The competition in the EMS sector has considerably intensified over the last few years,. The enormous pressure to reduce production costs, which every service provider today has to face, frequently forces the organization to have a critical look at their ...