Industry Directory | Manufacturer
Professional, Reliable,High Quality,Low Cost, Rapid Delivery PCB manufacturer
Industry Directory | Consultant / Service Provider / Manufacturer / Other
SHENZHEN KINGVINEW PCB CO.,LTD(www.szkingvinewpcb.com) supply PCB for NOKIA with high quality and competitive price. Hope to cooperate with you. Call me, let’s talk details! mary@szkingvinewpcb.com
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Electronics Forum | Wed Aug 09 04:09:04 EDT 2000 | Jarno Py�ri�
Hello. I think, good stencil apertures is 80% from pad. And stencil thickness is 0.15mm - 0.20mm. I use 0.15mm thick stencil almost every pcb. Sorry my very bad english but i too learning. :)
Electronics Forum | Mon Jun 13 14:34:16 EDT 2005 | peter ng
The stencil thickness should be 5.5 mils.The squeeze speed around 20mm/s,print gap 0.15mm,print separation 0.3mm/s.
Used SMT Equipment | SMT Equipment
JUKI KE-760 SMT Model :JUKI KE-760 name:multi-function perfect placement equipment condition:used year: 2005 theory speed ：0.32sec/chip accuracy :within+/-0.15mm Component mount range:1005~23.5QFPs Carrying rack:80 stations
Used SMT Equipment | SMT Equipment
Model :JUKI KE-760 name:multi-function perfect placement equipment condition:used year: 2012 theory speed ：0.32sec/chip accuracy :within+/-0.15mm Component mount range:1005~23.5QFPs Carrying rack:80 stations
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
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Parts & Supplies | Pick and Place/Feeders
FUJI - TOP CLAMP ..G4A042400E There are also other FUJI spare parts for you ! FUJI ANRG0670 JOINT JIG ASSY GL5 (GL5) (GL5) FUJI ANRG1100 JOINT ASSY. FUJI ANRG1106 JOINT ASSY. FUJI ANRG1107 JOINT ROTARY FUJI ANRG1200 FLOAT ASSY (GL5) (GL5) FU
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Parts & Supplies | Pick and Place/Feeders
FUJI Packing ..PH00990 There are also other FUJI spare parts for you ! FUJI ANRG0670 JOINT JIG ASSY GL5 (GL5) (GL5) FUJI ANRG1100 JOINT ASSY. FUJI ANRG1106 JOINT ASSY. FUJI ANRG1107 JOINT ROTARY FUJI ANRG1200 FLOAT ASSY (GL5) (GL5) FUJI ANRG
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
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» SMT Standard Nozzles » Yamaha | IPulse » M6-M7-M8-M10-M20 Series P-Nozzles » Yamaha | IPulse Ceramic 0.4 x 0.3/0.15mm, ID: P050 [LC6-M7727-000] Yamaha | IPulse Ceramic 0.4 x 0.3/0.15mm, ID: P050 [LC6-M7727-000] $ 280.00 Purchase this product now and earn 28 Points
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ko-KR/divisions/efd/products/dispense-tips/microdot-tips
투명 0.20mm 0.008" 50 7363483 테이퍼 형상 32.0mm 1.26" 27 검은색 (ESD-안전) 0.20mm 0.008" 50 7015236 챔퍼 6.35mm 0.25" 27 투명 0.20mm 0.008" 50 7018424 스테인리스 스틸 6.35mm 0.25" 30 연자주색 0.15mm 0.006" 50 7018433 스테인리스 스틸 12.7mm 0.5" 30 연자주색 0.15mm 0.006" 50 7018448 스테인리스
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