Industry Directory: 0.3mm pitch (1)

International Marketing Corporation

Industry Directory | Distributor

Representing Foreign Principals for their range of SMT / PCB Assembly equipments.

New SMT Equipment: 0.3mm pitch (24)

BGA Reballing Services

BGA Reballing Services

New Equipment | Rework & Repair Services

BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine

BEST Inc.

Solder Paste

New Equipment |  

Tamura's Solder Paste RMA Series is a solder paste, which consists of RMA type flux satifies QQ-S-571E and spherical solder powder with very little oxide. So flux residue after soldering becomes high reliable coating with excellent insulation resist

Aoki Laboratories Ltd. [Solder Products Supplier]

Electronics Forum: 0.3mm pitch (37)

Does anyone know of a 0.3mm pitch BGA or WL-CSP or anything with a 0.3mm pitch?

Electronics Forum | Mon Nov 16 20:22:52 EST 2015 | billthebuilder

I need one for testing a PnP machine. It's very hard to hunt something down just by package, so does anyone know of anything with a 0.3mm pitch? BGA preferred. Or clues where to look? Thanks!

Does anyone know of a 0.3mm pitch BGA or WL-CSP or anything with a 0.3mm pitch?

Electronics Forum | Tue Nov 17 17:05:50 EST 2015 | davef

Look here: http://www.topline.tv/Pitch.html We receive no benefit from posting the link above.

Used SMT Equipment: 0.3mm pitch (45)

Samsung chip mounter CP45FV04

Samsung chip mounter CP45FV04

Used SMT Equipment | Flexible Mounters

Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung CP45FV-NEO chip mounter

Samsung CP45FV-NEO chip mounter

Used SMT Equipment | Pick and Place/Feeders

Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: 0.3mm pitch (43)

Design Decisions That Reduce Manufacturing Costs

Industry News | 2018-10-18 10:06:45.0

Design Decisions That Reduce Manufacturing Costs

Flason Electronic Co.,limited

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

Parts & Supplies: 0.3mm pitch (1)

Samsung SM481 Chip Mounter

Samsung SM481 Chip Mounter

Parts & Supplies | Chipshooters / Chip Mounters

Samsung SM481 Chip Mounter Focus on the way flight vision + fixed vision (optional) Number of axes 10 axes * 1 gantry Mounting Speed 0603 39000 (Best Conditions) Mounting accuracy chip ± 50um @ 3ó / chip, QFP ± 30um @ 3ó / chip Component Ra

ZK Electronic Technology Co., Limited

Technical Library: 0.3mm pitch (2)

Step Stencil design when 01005 and 0.3mm pitch uBGA's coexist with RF Shields

Technical Library | 2023-07-25 16:50:02.0

Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.

Photo Stencil LLC

An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios

Technical Library | 2017-09-28 16:36:33.0

These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.

FCT ASSEMBLY, INC.

Videos: 0.3mm pitch (10)

Online AOI Machine

Online AOI Machine

Videos

ETA DIP Inverted Camera Online AOI Machine ETA-V5200 ​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m

Dongguan Intercontinental Technology Co., Ltd.

DIP Double-side Camera Online AOI Machine ETA-V5300

DIP Double-side Camera Online AOI Machine ETA-V5300

Videos

DIP Double-side Camera Online AOI Machine ETA-V5300​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac

Dongguan Intercontinental Technology Co., Ltd.

Events Calendar: 0.3mm pitch (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Resumes: 0.3mm pitch (1)

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

Express Newsletter: 0.3mm pitch (163)

Partner Websites: 0.3mm pitch (25)

SAMSUNG CP45F SMT Pick And Place Machine

| https://www.feedersupplier.com/quality-13118524-samsung-cp45f-smt-pick-and-place-machine

) Special Fixed Camera (FOV20) ~ 17mm IC (Lead Pitch: 0.3mm) Special Fixed Camera (FOV45) ~ 42mm IC (Lead Pitch: 0.5mm)   Leading Pitch (QFP) 0.3mm (with FOV20 Vision)   Min. Ball Pitch (BGA) 0.5mm (with FOV20 Vision)   Parts up to 15mm (9mm: with flying vision) PCB Size 50mm x 50mm Min

Used Surface Mount I Pre-owned PCB Assembly - Lewis and Clark, Inc.

Lewis & Clark | https://www.lewis-clark.com/

: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability Dual-Vision Alignment System Integral Vacuum Max Placement Area: 13.8″ x 17.1

Lewis & Clark


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