Industry Directory | Consultant / Service Provider / Manufacturer
Tropical Stencil is dedicated to providing the highest quality Laser Cut Stencils; with our rapid response, you will have your Stencil delivered on-time.
Industry Directory | Consultant / Service Provider
PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.
New Equipment | Assembly Services
Hanwha HM510 SMT Assembly Line Hanwha HM510 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
New Equipment | Assembly Services
Hanwha HM510 SMT Assembly Line Hanwha HM510 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
Electronics Forum | Fri Oct 31 07:52:23 EDT 2008 | davef
For a better understanding of decoupling capacitors, look here: * http://en.wikipedia.org/wiki/Decoupling_capacitor * http://www.hottconsultants.com/techtips/decoupling.html * http://pcdandf.com/cms/content/view/3410/95/
Electronics Forum | Thu Oct 30 15:07:40 EDT 2008 | jemills
Hello I have a new 0402 pad design on a recent board were building in future. On closer look i thought the pad was a thru hole mount , but upon closer inspection the round pads are for 0402 comps. I had a discussion with the engineer and he said
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | Screen Printers
DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Lumberton, New Jersey USA | Engineering
Reports to: Cad/Laser Manager Department: Cad Location: Lumberton Phone: 609-261-2670 Ask for Greg Starrett Email: Send resume as a word document or PDF to greg@metassocs.com Job Summary: Under the general supervision of the Cad Manager
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
SMTnet Express, September 28, 2017, Subscribers: 30,862, Companies: 10,741, Users: 23,873 An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios Jasbir Bath, Tony Lentz, Greg
| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print
• Skips in the printed solder due to blocked stencil aperture • Misaligned solder print • Improper stencil thickness • Inadequate stencil aperture size
Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/
stencil aperture Misaligned solder print Improper stencil thickness Inadequate stencil aperture size Excessive pad size Via in pad draining solder from interconnection Reflow-related causes of
