Industry Directory | Manufacturer
Semiconductor Company which design FBGA and its own PCB Board to test our chips.
Industry Directory | Distributor
Our core business is distribution of electronic components. TI, AMD, Xilinx, Altera,ST, Infineon, Intel, Broadcom, electric components, integrated circuit, MCU's, flash-memory chips.
New Equipment | Design Services
FPGA Design Service, FPGA Development Service, FPGA Prototyping Service Extensive experience with FPGA Design, Development & Prototyping. We are the preferred manufacturer and design partner for Xilinx, Altera, Lattice & Tabula. Our work ranges
Electronics Forum | Mon Jun 30 08:55:45 EDT 2003 | Steve Gregory
Has anybody ever done a double-sided reflow with a Altera 240-pin RQFP on the bottom? The part has a heatsink in the top and weighs just over a half-ounce... Thanks in advance! -Steve Gregory-
Electronics Forum | Tue Jul 25 11:30:47 EDT 2006 | DC
Russ, we had similiar issue on the corner seperation. The board is ENIG and the part is Altera FBGA 1020 (Super BGA) and reflowed by tin/lead paste. Please comment your concern on Altera parts! Is CTE mismatch?
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight MSO6034A Bandwidth: 300.0 MHz Channels: 4 Agilent MSO6034A Mixed Signal Oscilloscope: 300 MHz, 4 scope and 16 digital channels If you work with both analog and digital circuitry, Agilent Technologies 6000 Series oscilloscopes c
Industry News | 2003-04-30 08:37:19.0
Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs
Industry News | 2011-04-20 21:19:17.0
IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Shenzhen Fuwo Technology Co., Ltd. Our main product brands include semicolon, infinitely, Mitsubishi, Fuji, Hitachi, Siemens, Sanyo, ABB, PRX, IR, IP, TDK, POWER-ONE, AEG, NEC, APT, ST, TI, AD, ST, AVX, ALTERA, Seattle, IXYS, MICRON, MXIC, SPANSION,
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Whizz Systems | https://www.whizzsystems.com/careers/
(Altera, Xilinx ISE8.1i and ModelSim). Minimum Education: Master’s Degree in Electrical Engineering. Minimum Experience: Six (6) months. Must have completed coursework in C/C
