DEK Galaxy SMT Stencil Printer Maximum printing surface： 510 mm* (X) x 508.5 mm (Y)Printing speed: 2 mm/sec to 300 mm/secWeight: Approx. 680 kgProduct description: DEK Galaxy SMT Stencil Printer, Maximum printing surface： 510 mm* (X) x 508.5 mm (Y),
High Quality Transmission Parts CNC Machining Specification: 1. Process: CNC machining 2. Aluminum housing 3. Smooth surface 4. ISO certified factory 5. Accept small OEM trial order Our products have been exported to Japan,Unite States,South Ko
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Thu Aug 21 16:58:25 EDT 2003 | justin
With a eutectic ball, you'll see about a 50% collapse. This negates that .008" issue you're referring to. With a high temp ball, you don't enjoy the same freedom regarding ball collapse. Dave is correct, though. We recently got IBM to sign up to
Used SMT Equipment | Pick and Place/Feeders
Machine Type YS12F Applicable PCB L510mm x W460mm to L50mm x W50mm Mounting accuracy Absolute accuracy（μ＋3σ） +/-0.05mm/CHIP Mounting tact 20,000CPH（under our optimum condition） Component supply Tape reel, tray Number of
Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale (2) identical systems available..... Both in very good running condition and can be inspected under power..... See attached pictures and inform
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2007-11-08 21:34:39.0
Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.
Parts & Supplies | Pick and Place/Feeders
Product Description · * □ 32mm need to install special nozzle assembly · H15mm corresponding height · Identify the ball electrode · 107 corresponds to the maximum number
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Parts & Supplies | Chipshooters / Chip Mounters
Juki 40053295 Hc-RP153D-S2 Ke2070/2080) Y Axis Motor Model NO.: Hc-rp153d-s2 Type: High-speed Chip Mounter Part Name: Juki Ke2070/2080) Y Axis Motor 40053295 Hc-RP153D- Typ: Juki SMT Sapre Parts Quality: 100% Tested Lead Time: 1-3days Trademark: JU
Technical Library | 2021-12-16 01:45:05.0
In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.
Hello and thank you for your interest in our MPM SPM Semi-Automatic Stencil Printers For Sale. We have 2 systems available and both are in excellent condition. This listing below is for one of the printers. MPM - Speedline Technologies Model:
ETA DIP Inverted Camera Online AOI Machine ETA-V5200 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
KingFei SMT Tech | http://www.smtspare-parts.com/sale-9372741-npm-16nh-ball-spline-n510056485aa-smt-spare-parts-n510068432aa-panasonic-ball-spline.html
: 16NH Ball Spline Material: Metal Usage: NPM Machine Part Number: N510068432AA N510056485AA Package: 1pcs/bag Weight: 0.3KG Condition: Original New Brand: THK Specifications: N510068432AA Application NPM 16HEAD First part code N510068432AA Old part code N510064335AA Packing yellow plastic packing
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post10645.html
. The diameter of the land should be no larger than the diameter of the land at the package interface and is typically 20% smaller than the normal diameter specified for the ball contact for pitches greater than 1.0 mm and 10
