Full Site - : best solder paste sac 305 (Page 10 of 38)

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Industry News | 2017-08-10 17:43:56.0

Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.

Nihon Superior Co., Ltd.

Soldering and Joint Encapsulation with One Step Reflow from SHENMAO

Industry News | 2021-08-26 11:02:27.0

SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.

Shenmao Technology Inc.

Nihon Superior Shanghai to Exhibit at NEPCON China 2012 Implementing Lead-Free Soldering with Cost Reduction and Reliability

Industry News | 2012-03-28 15:59:44.0

Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.

Nihon Superior Co., Ltd.

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Industry News | 2016-08-30 15:31:51.0

Nihon Superior Co. will exhibit in Booth #418 at SMTA International, scheduled to take place September 27-28, 2016 at Donald Stephens Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Co., Ltd.

Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining

Industry News | 2017-01-10 08:37:14.0

Nihon Superior will exhibit in Booth #2610 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Co., Ltd.

FCT Assembly to Highlight a Range of Proven Pastes at SMTAI 2010

Industry News | 2010-09-29 01:30:07.0

FCT Assembly to highlight its leading solder pastes and stencil technologies in booth 226 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

FCT ASSEMBLY, INC.

Nihon Superior USA Exhibits SN100C at IPC International Conference on Flexible Circuits 2008

Industry News | 2008-02-15 15:45:43.0

OSAKA, JAPAN � February 13, 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it showcased its SN100C products with FCT Assembly, one of its US SN100C Global Partners, at the IPC International Conference on Flexible Circuits, that took place February 13, 2008 in Phoenix, Ariz.

Nihon Superior Co., Ltd.

Indium Corporation Technology Experts to Present at IPC Southeast Asia High Reliability Conference

Industry News | 2014-08-07 11:41:44.0

Indium Corporation's Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.

Indium Corporation

SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability at SEMICON Southeast Asia

Industry News | 2018-04-25 20:05:59.0

SHENMAO America, Inc. today announced plans to exhibit in Booth 433 at SEMICON Southeast Asia, scheduled to take place May 22-24, 2018 at the new Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur. SEMICON SE Asia is the region's premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain. SHENMAO plans to introduce its new PF906-S and PF912-S solder alloys.

Shenmao Technology Inc.

Industry Responds to FCT Solder's NC162 No Clean Liquid Flux

Industry News | 2008-10-07 18:25:16.0

GREELEY, CO � October 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it has recently seen an increase in sales of NC162 flux.

FCT ASSEMBLY, INC.


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