New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
Electronics Forum | Tue Sep 21 13:12:56 EDT 1999 | Dave F
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | Greg: I was going to link you to the IPC land pattern c
Electronics Forum | Wed Apr 28 12:18:04 EDT 1999 | Scott McKee
| Hello all, | | I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area
Used SMT Equipment | Flexible Mounters
Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s
Used SMT Equipment | Pick and Place/Feeders
Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
| https://www.feedersupplier.com/sale-12961129-samsung-sm471-plus-smt-pick-and-place-machine.html
) Component Range: Chip 0402( 01005)- 14mm (12mm), IC, connector (Lead Pitch 0.4mm), BGA, CSP (Pitch 0.4mm). Board Dimension (mm): Minimum order: 50(L) x 40(W), Maximum: Single tool: 510(L) x 460(W), dual tool: 460(L) x250(W). PCB Thickness: 0.38 - 4.2mm Feeder Capacity: (Based On 8mm)120ea /(Docking Cart) 112ea. Utility-Power: AC200/ 208 / 220 / 240 / 380 / 415V
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Anderson, Ph.D. Abstract 27-2 Reliability Degradation of SAC105 and SAC305 BGA Packages Under Long-Term, High Temperature Aging Zhou Hai, Jiawei Zhang, Chaobo Shen, E. K. Snipes, J. C. Suhling, M. J. Bozack and J. L. Evans Abstract 27-2 3-D Fracture Analysis
