Industry News | 2012-05-15 08:57:25.0
Practical Components Inc., a leading supplier of dummy components, has introduced a display case containing a sampling of components.
Industry News | 2011-04-05 21:42:34.0
Machine Vision Products (MVP) will be demonstrating its expanded range of AOI systems at APEX 2011 in Las Vegas. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Booth 1647.
Industry News | 2021-10-11 08:08:21.0
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces the release of its new Meister D+ semiconductor inspection solution. Premium True3D™ Inspection Solution for Chiplets and System-in-Package (SiP) devices including die and surface mount components. The new Meister D+ is an extension of the Meister product family that features solutions ranging from solder paste, printed bumps, and solder ball to small components like 0201Ms and highly reflective die.
Industry News | 2015-10-26 20:18:50.0
DEN-ON INSTRUMENTS, CO., LTD. is pleased to announce new improvements to its long-standing RD500 Series Rework Station. The RD500V series is now higher powered and comes with added profiling features that have evolved the system into an even easier to use and very intuitive machine for engineering and operator use.
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Thu Dec 07 14:23:30 EST 2006 | russ
I wuld say it is attachment method and post install force that is the problem not the size of the heatsink. we place heatsinks that are at least 5 times the size of BGA with no issue, they are attached with very precision torque drivers. Russ
Electronics Forum | Thu Dec 07 10:10:49 EST 2006 | Learn from U
Hello, I need your advice..Welcome any input!! Cheers..
Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef
We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.
Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr
Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.
