New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Electronics Forum | Fri Jan 22 16:03:17 EST 2021 | SMTA-64387124
Does anyone see any issues in mixing SMD and NSMD pads within one BGA footprint. We have high current pads which we want to make SMD and the other signal pads to be NSMD
Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri
The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | Pick and Place/Feeders
Panasonic nozzles available for MSF/MCF/HDP/HD/CM/DT Series MSF Series Nozzles Part Number Description PAMSFSSD Nozzle, SS (Diamond Tip) 1045 9080 04 Nozzle Tip Only, SS (Diamond Tip) PAMSFSD Nozzle, S (Diamond Tip) 1045 9080 14 Nozzle Ti
Parts & Supplies | SMT Equipment
MV MV2 MV2C MV2F MV2VB Series Nozzles Part Number Description 1020 1750 15XX Nozzle, RSS(S), #1 (Shinny Tappered Tip) 1020 1530 00 Nozzle, M-1.2, #2 1020 1795 61xx Nozzle, M-1.6, #2 1020 1795 00xx Nozzle, L, #3 1020 1750 11xx
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Pad Cratering - The Invisible Threat to the Electronics Industry SMTnet Express September 6, 2012, Subscribers: 25455, Members: Companies: 8972, Users: 33613 Pad Cratering - The Invisible Threat to the Electronics Industry First published
| https://www.eptac.com/soldertip/soldertip-46-open-connections-found-on-bga-components/
: Class 2 vs Class 3 Assemblies SolderTip #40: Component Mounting and Acceptability Question : We have been stumped by occasional opens at the corner balls of some BGA components after reflow
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
, °C ALLOY COMPOSITION, wt% PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 4 of 24 Rev Level: 1 Rev Date: 1/03/01 Eutectic Vs. Lead Free Process window comparison Conclusions
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