Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
New Equipment | Rework & Repair Equipment
We are a distributor of Chip Quik SMD rework products. Call for pricing or check out our on line store: https://youtu.be/DBJ1MxqD3d0 (888) 406-2830
JUKI RX-7R Pick and Place Machine Applicable Components: 03015 chip ~ 25mm square elementBoard size:510mm×450mmFeeder inputs:max 76placement capacity:75,000CPHProduct description: JUKI RX-7R Modular Pick and Place Machine,Applicable Components: 0301
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Fri Jan 10 16:59:08 EST 2003 | mk
www.sipad.com/Motorola/MotorolaFlipChip.htm
Used SMT Equipment | Chipshooters / Chip Mounters
Juki FX-1R Pick & Place Machine, Chip Shooter: high Speed Modular Mounter FX, 33,000 CPH, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM
Used SMT Equipment | Chipshooters / Chip Mounters
Quad IVC Pick and Place Location: San Antonio, TX S/N:2383
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-06-18 07:56:46.0
The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard.
Parts & Supplies | Chipshooters / Chip Mounters
SMT JUKI FF12MM CHIP MOUNTER FEEDER More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Parts & Supplies | Chipshooters / Chip Mounters
SMT JUKI FF12MM CHIP MOUNTER FEEDER More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
BTW, we have sepcialzied in SMT field over 12 years and support one-stop SMT solution for our customers. Including SMT equipment and spare parts, such as Loader and Unloader, Reflow oven, Nozzle, feeder, motor, PCB board ect. We can also customize
Description MODEL ID: CM402-L MODEL NUMBER: KXF-4Z4C PCB DIMENSIONS: L 50 mm x W 50mm to L 510 mm Ã? W 460 mm HEAD TYPE: Type A-2 (12/12 nozzles HIGH-SPEED) (OPTION) Number of nozzles: 12 nozzles/head Maximum speed: 0.052 s/chip (69,500
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | , New Jersey USA | Engineering
Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | Cebu, Philippines | Engineering,Maintenance,Technical Support
Experience SMT machine maintenance and SMT process from raw materials to finish goods
SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ko-KR/divisions/polymer-processing-systems/products/screws/x8000-encapsulated-screws
코팅과 관련된 치핑(chipping) 또는 박리 문제가 발생하지 않음 스크류 재생 – Xaloy® X-8000™ 은 수리가 가능하며 외경 복원도 가능합니다. 특징: 스크류 기본 소재에 대해 100% 야금 접합이 가능 280MPa의 표준 접합 강도 완전한 Nordson 마모 시스템 - 최상의 마모 보호 성능 제공: 스크류 루트 표면의 Xaloy X-8000™ 카바이드 피복 스크류 날개 OD의 Xaloy X-830® 카바이드 표면 경화 Xaloy X
GPD Global | https://www.gpd-global.com/co_website/surface-mount-adhesive-smt-glue.php
. By flying above the surface and eliminating Z axis motion, the pump is unaffected by surface height variations known as "potato chipping
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