Industry News | 2012-12-13 13:23:38.0
IPC-7527, Krav til Tinpastatryk, is also the first standard ever developed that focuses on the application of one of the industry’s most basic infrastructure elements, solder paste.
Industry News | 2013-09-06 15:42:34.0
IPC – Association Connecting Electronics Industries® announces its online store is selling the 2013 Roadmap from the International Electronics Manufacturing Initiative (iNEMI) through a special agreement between the two organizations.
Industry News | 2003-08-27 10:43:02.0
This 41-page document is the complete source for printed circuit board and electronics assembly standards and publications for design, materials, manufacturing, assembly, quality and test.
Industry News | 2018-08-16 19:58:50.0
The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.
Industry News | 2021-09-30 16:20:50.0
IPC is calling on the U.S. electronics manufacturing community to contact members of Congress about a bill that would boost investment in federal research and development (R&D) in 10 high-tech fields. We hope your media organization will help us publicize this effort.
Industry News | 2019-08-21 16:17:24.0
Nordson ASYMTEK introduces its Forte™ Series fluid dispensing system. The Forte Series combines high accuracy fluid dispensing with increased throughput and productivity in a narrow footprint to handle applications such as flex circuit and printed circuit board assembly, electro-mechanical assembly, MEMS, underfill, precise coating, and encapsulation.
Industry News | 2011-11-11 14:38:51.0
Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
Industry News | 2012-10-31 15:53:31.0
B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).
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