New Equipment | Test Equipment
Metal dome (also named snap dome, tacticle domes) is the most improtant part of the switches. The metal domes are mainly use in the membrane switches, printed circuit boards, flexible circuit boards. The raw material is the thickness from 0.05mm to 0
The New Plug & Print 3D Printer with Dedicated Software and Filament. 3D printer valued by thousands of users. The reliable, efficient and extremely precise Zortrax M200 has already won the hearts of thousands of users. The device’s affordable pric
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Used SMT Equipment | Pick and Place/Feeders
Make: FUJIModel: FUJI AIMEXIIICDetails:1.Compact Size: The AIMEXIIIC is designed to be compact, suitable for production environments with limited space. The machine size is L: 1,280 x W: 2,346 x H: 1,465 mm.2.High Versatility: Supports placement fro
Used SMT Equipment | Pick and Place/Feeders
Make: FUJIModel: FUJI AIMEXIIICDetails:1.Compact Size: The AIMEXIIIC is designed to be compact, suitable for production environments with limited space. The machine size is L: 1,280 x W: 2,346 x H: 1,465 mm.2.High Versatility: Supports placement fro
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2002-03-29 07:49:10.0
A Corporate Workforce Reduction of 25%
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
Technical Library | 2024-06-23 22:03:59.0
The melting temperatures of most lead-free solder alloys are somewhat higher than that of eutectic Sn/Pb solder, and many of the alloys tend to wet typical contact pads less readily. This tends to narrow down the fluxing and mass reflow process windows for assembly onto typical organic substrates and may enhance requirements on placement accuracy. Flip chip assembly here poses some unique challenges. The small dimensions provide for particular sensitivities to wetting and solder joint collapse, and underfilling does not reduce the demands on the intermetallic bond strength. Rather, the need to underfill lead to additional concerns in terms of underfill process control and reliability. Relatively little can here be learned from work on regular SMT components, BGAs or CSPs.
15W UV Laser Economic PCB Laser Depaneling System PCB Laser Depaneling System Specification: Laser solid-state UV laser Laser Wavelength 355nm Laser Source UV 15W@30KHz Positioning Precision ±2μm
UV Laser PCB Depaneling System, Dual Table for High Volume Laser Depaneling Purpose: The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations. Efficient integration
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(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smd-solder-mask-defined-and-nsmd-pads_topic1768.html
. The NSMD BGA pad stack is necessary for the Ball to fully collapse around the pad edge securing it to the PCB - The SMD (Solder Mask Defined) BGA pad stack prevents the Ball Collapse
