Electronics Forum: cu-osp on leadframe (9)

Wrinkle solder ball on BGA PKG

Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band

I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi

Non-wetting on QFP lead

Electronics Forum | Wed Nov 21 19:45:36 EST 2001 | Yngwie

Hi Guys, I need help. I�ve a trouble with non-wetting problem on the lead of 208 pin, 20 mils pitch QFP. We are on intrusive reflow. I never faced this problem before on this product after running them for about 2 years now. This occurred on one pa

Industry News: cu-osp on leadframe (4)

Practical Components Offers Dummy Triple Stack Package on Package

Industry News | 2008-05-23 18:09:23.0

LOS ALAMITOS, CA � May 20, 2008 � Practical Components Inc., the leading supplier of dummy components, announces the availability of a dummy version of the Amkor� middle stacked package that makes a Triple Stack PoP package (PSvfBGA).

Practical Components, Inc.

Practical Components Offers Amkor TMV® PoP (Package on Package) Daisy Chain Components

Industry News | 2011-01-05 17:46:58.0

Practical Components Inc. announced the availability of daisy chain samples of Amkor Technology, Inc.’s TMV® PoP (Package on Package) solution.

Practical Components, Inc.

Express Newsletter: cu-osp on leadframe (8)

Partner Websites: cu-osp on leadframe (15)

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

experiments in this study were performed on an OSP finished board. Finishes such as OSP which do not have a nickel later represent the worst case scenario with respect to Cu dissolution. An OEM server product was used as the test vehicle throughout this study

Surface Mount Technology Association (SMTA)

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print

.  Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package


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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411