Used SMT Equipment | Assembly Accessories
we need Besi Die Bond: Type: Datacon 2200 Evo 8800FC ,2200 APM+
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
winsouce.jpg)
