Electronics Forum | Sat Oct 09 03:45:34 EDT 1999 | Brian
| Right now,we have some problem on SMT. Cause of the flux residue | in the connector. Do somebody have the same symptom? By the way, | can i find something to make the flux observe easy or take a photo with the flux. | | | Unfortunately, this pr
Electronics Forum | Fri Oct 14 09:21:36 EDT 2005 | lupo
According with temperature vs. wetting force diagram 245-250C/degrees is better, so lower temperature than 500F means better solder fill. If the speed is too lower the solder suck out form the hole. Usually 120-150cm/min. is good. (2-4s contact
Electronics Forum | Fri May 07 15:58:36 EDT 2010 | smt_guy
I'm looking for an optical scope that can penetrate through a gap of 0.005" to 0.010". Is there anything available in the Electronics / Semiconductor Industry for this kind of application? I want to see what's inside that size of gap for solder short
Electronics Forum | Tue Apr 23 17:18:54 EDT 2019 | laserpro
Hi Dave, Thanks a lot for your reply. After doing some process work on a Laser Etching machine it was brought to my attention by a colleague that if the solder mask was being penetrated fully, we could be at risk for absorption of moisture leading
Electronics Forum | Tue Apr 23 10:31:59 EDT 2019 | laserpro
Hi all and thanks for viewing my post! My questions related to the subject line are as follows: 1. Does the Epoxy Solder Mask Layer of a PCB protect against moisture absorption? Is this a primary function of the solder mask? 2. Does exposed FR4 na
Electronics Forum | Tue Apr 23 15:36:27 EDT 2019 | davef
Josh, are you setting someone up with these questions? Answers to your questions related to the subject line follow: Q1. Does the Epoxy Solder Mask Layer of a PCB protect against moisture absorption? Is this a primary function of the solder mask?
Electronics Forum | Wed Apr 23 21:34:24 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board
Electronics Forum | Tue Apr 22 03:46:19 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board
Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette
I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
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