Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Wed Jun 18 01:47:25 EDT 2008 | sleech
Innovative Drying Co., considered this possibility early in our experiments. The rate of chamber pump-down is not a consideration. However, the selection of the vacuum pump is critical. Avoid oil-sealed pumps at all costs. A poorly maintained oil-tra
Electronics Forum | Mon Dec 15 15:34:17 EST 2008 | dyoungquist
Sorry it has taken me so long to respond. I got pulled off onto other projects and was not able to work on the solution to the problen until recently. The solution we have come up with is to change from no-clean flux based solder paste to water sol
Electronics Forum | Mon Jun 28 22:44:13 EDT 2004 | davef
Q1: What is the most popular PCB finish for lead-free soldering ? A1: We'd guess ENIG Q2: Who drives the selection of the finish, assembler or designer ? A2: A tight circle of recrimination, blame letting, and other human ills that is primarily driv
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Wed Nov 12 18:58:19 EST 2008 | joeherz
I attended SMTA's copper dissolution webinar this morning and am almost convinced that this is not our problem. Still planning to do cross sections to verify but our dwell times are nowhere near levels that could cause a problem assuming good platin
Electronics Forum | Tue Feb 07 13:39:42 EST 2006 | gregoryyork
You can use straight forward Tin/Copper but it flows very poorly so solderability is an issue. Dosing with Phos improves this but need to stay on top of it. We have supplied some 3.8%Ag alloys for flow they work well but you get a small 'chill point'
Electronics Forum | Tue Apr 28 21:48:50 EDT 2009 | davef
Confirm the source of the issue. Run a coalescence test on both lots of paste. A simple coalescence test can quickly determine the condition of solder paste after prolonged use. Simply print a small disk [around 4-5mm diameter and 0.2mm thick - a bu
Electronics Forum | Fri Dec 15 13:57:46 EST 2000 | genny
It is only after the reflow heating process that the peaks may show up, as the solder build up in some vias(due to HASL'ing) might drip down during reflow. I don't think I've ever heard of it being desirable to have a bare copper surface that will ox
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