Industry Directory | Consultant / Service Provider / Manufacturer
Microtek focuses on optimum microelectronics packaging solutions from prototype to production for applications in: Die Attach, Die Sorting, Flip Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, RFID..
Industry Directory | Manufacturer
Manufacturers of high performance epoxy and silicone resins for potting/encapsulating, coating, bonding, sealing, and die attach. Thermally conductive, UL listed systems for electronic, electrical, & industrial applications.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Electronics Forum | Wed Apr 02 23:02:38 EST 2003 | scottf
I agree with Iman. Verify the integrity of the component for moisture. Most definately place an amount of ownership on your PCB supplier. Request tank analysis results and copies of the lot travelers. Look specifically for any in process rework pro
Electronics Forum | Tue Apr 01 11:50:08 EST 2003 | rdr
Dave, thanks for the info. This sounds like it would verify the presence of an open. We have verified that these balls are open and I am trying to figure out if we are fracturing or not wetting. causing these opens. I would use the die method on ne
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Used SMT Equipment | X-Ray Inspection
Very Nice Nicolet Xray Machine For Sale The system is complete and in good working condition See attached pictures and information below Nicolet Imaging Systems Model Number: NXR-1500 Serial Number: 0150011 Year 2000 Variable Speed Joystick
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2011-09-12 12:04:25.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics
Parts & Supplies | Pick and Place/Feeders
Cable: Control Die-Attach-Unit
Parts & Supplies | Pick and Place/Feeders
Transfer-X Motor Die Attach
Technical Library | 1999-08-27 09:24:56.0
Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | , British Columbia Canada | Engineering
Looking for an engineer or technician to do some contract work on the assembly, testing, and failure of analysis of microelectronics packagages. The individual needs to understand the process of gold wire bonding and eutectic die attachment. Knowle
Career Center | Melbourne, Florida USA | Engineering,Research and Development
Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and networ
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2417.html
: Control Die-Attach-Unit Cable: Control Die-Attach-Unit PREVIOUS： 00386010-01 NEXT： 00386097-02 RELATED PRODUCTS CATEGORIES ABOUT US + SURFACE MOUNT SYSTEM + REFLOW FURNACE + OTHER PARTS + CONTACT US + CONTACT US Tel
