Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Electronics Forum | Fri Oct 20 14:13:32 EDT 2000 | DENNIS XIONG
Dear all, We have a PCB design mistake that causes exposed copper layers on the edges of breakaway locations. Although we fixed the design, but we already made a lot of boards plus many made before we found the problem. I wonder if any one have some
Electronics Forum | Wed Jun 26 22:05:35 EDT 2019 | SMTA-Chi Hong
Hello all, Recently there is component SOIC8L HD leadframe with the exposed Cu on shoulder side and lead tip. Is anyone have experience running with this type of component?Thanks
Used SMT Equipment | Semiconductor & Solar
Standard Machine features and system description: Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High ac
Industry News | 2014-10-01 15:59:00.0
PCB provider Cirtech Electronics located in Cape Town, South Africa will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid. Bidding for the auction will open promptly at 8:00am PDT on October 7th, 2014 and will begin closing at 6:00am PDT on October 14th, 2014.
Industry News | 2014-10-10 16:27:51.0
CB provider Cirtech Electronics will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid.
Parts & Supplies | Repair/Rework
Repair parts include: CPU circuit board repair and maintenance of the I / O board, servo circuit board repair, the image processing circuit board repair, industrial CCD camera repair, frequency converter repair, PLC repair, touch screen repair, laser
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
SMTnet Express, August 31, 2017, Subscribers: 30,770, Companies: 10,706, Users: 23,739 NSOP Reduction for QFN RFIC Packages Mumtaz Y. Bora; Peregrine Semiconductor Wire bonded packages using conventional copper leadframe have been used in industry
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Laser direct imaging exposes certain parts of the board to light in the shape of the PCB pattern. Any unexposed parts of the board will develop off, leaving the remaining film as an etch barrier The remaining film serves as an etch barrier that will be removed from the exposed copper to form the copper circuitry
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. Phenolic resin is resistant to weak acids and weak bases. It will decompose when exposed to strong acids and will corrode when exposed to strong bases
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