FOXBORO 11GM-CS1 PRESSURE XMTR FOXBORO 1210-03-D PHASE DET/AMP FOXBORO 130M-N2 PNEUMATIC CTRL FOXBORO 130M-N4 PNEUMATIC CTRL FOXBORO 130M-N5 PNEUMATIC CTRL FOXBORO 13A TRANSMITTER FOXBORO 13A1-MKS TRANSMITTER FOXBORO 13AH-S2 TRANSMITTER FOXBO
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
Electronics Forum | Sat Apr 16 13:43:53 EDT 2005 | KEN
What about electo migration? I had (what apears to be) the exact same problem you describe. X-ray and ICT fails to detect micro shorts. However, in our test, the bench functional test would show a current overload. In some cases the electro migrti
Industry News | 2021-05-25 12:56:56.0
The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:
Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
+ cycles Investigation Conclusion: Typical void size was 2-3% diameter, overall range was 0-24% diameter Voids were typically found at solder joint / BGA package interface
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