Industry Directory | Consultant / Service Provider
An independent solder analysis lab. Our services include solder analysis of wave solder machines and solder pots. We test for impurities based on J-STD-006B for most tin and lead based alloys.
Industry Directory | Consultant / Service Provider
Elmet LLC is an accredited lab, primarily providing cross sectioning of circuit boards, visual and x-ray inspections of PCBAs and other metallographic and metallurgical services including SEM examination and EDS analysis.
New Equipment | Test Equipment
MUST System III – Solderability test system (wetting balance) tests to IEC 60068-2-54 and 60068-2-69, MIL-STD-883 Method 2022, IPC/IEC J-STD003A, IPC/IEC/JEDEC J-STD-002B and EIA/JET-7401. Includes everything needed for all forms of solderability t
New Equipment | Test Equipment
“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations. After the dip process, the operator inspects the terminatio
Electronics Forum | Thu Nov 19 13:49:00 EST 2009 | bricke
We have been manufacturing a part using bright electrolytic tin as the finish. Our customer has been hand soldering using 63/37. They have recently switched to SN96 and have been experiencing solderability issues. We have sent samples to an outside
Electronics Forum | Thu Feb 11 20:38:47 EST 2016 | davef
Try: * J-STD-003 “Solderability Tests for Printed Boards” * IPC-4555 OSP Finish Specification
Used SMT Equipment | General Purpose Test & Measurement
Takaya APT-820S Flying Probe Tester Model: APT-820SYear of Manufacture: 2007Serial number: V7F56002Protection: IP-4X2 movable probes for medium board sizes up to 255 mm x 330 mmVoltage: 220V, AC, Single Phase, 50/60 HzPower: 2.0 kVAMade in Japan 100%
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2013-10-21 16:05:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards at IPC’s Fall Standards Development Committee Meetings last week in Fort Worth, Texas.
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
Technical Library | 2020-12-10 15:49:40.0
Electronic assemblies should have longer and longer service life. Today there are partially demanded 20 years of functional capability for electronics for automotive application. On the other hand, smaller components, such as resistors of size 0201, are able to endure an increasing number of thermal cycles until fail of solder joints, so these are tested sometimes up to 4000 cycles. But testing until the end of life is essential for the determination of failure rates and the prognosis of reliability. Such tests require a lot of time, but this is often not available in developing of new modules. A further acceleration by higher cycle temperatures is usually not possible, because the materials are already operated at the upper limit of the load. However, the duration can be shortened by the use of liquids for passive tests, which allow faster temperature changes and shorter dwell times because of better heat transfer compared to air. The question is whether such tests lead to comparable results and what failure mechanisms are becoming effective. The same goes for active temperature cycles, in which the components itself are heated from inside and the substrate remains comparatively cold. This paper describes the various accelerated temperature cycling tests, compares and evaluates the related degradation of solder joints.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Tue Feb 18 00:00:00 EST 2020 | ,
Corrosion Testing For Electronic Equipment
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | Clarksburg, Maryland | Engineering
Immediate opportunities for SMT Solder Specialist. Also have these positions open. All immediate opportunities: Assembler: Must have strong electro mechanical manufacturing skills. Experience with assembly of electro mechanical products in a high
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/about-us/standards/ipc-j
– Solderability Test for Printed Boards (Lötbarkeitsprüfung für Leiterplatten) J-STD-004 – General Requirements and Test Methods for Soldering Fluxes
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
) quality and reliability specifications. J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies states that validation and verification be confirmed with test vehicles that are representative of the product being produced
