Industry Directory | Manufacturer
Since 1999, Dresden, Germany-based, FILLING EVOLUTION GmbH, has excelled as a premier filling machine manufacturer, specializing in cutting-edge FILLOGY® machines, showcasing innovation and precision.
Industry Directory | Equipment Dealer / Broker / Auctions
Best China Filling Bottling Production Line Manufacturer of Liquid Drinking Water, Beverage, Soft Drinks, Juice, Dairy Milk, Edible Oil, Detergent, Pesticide, etc.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Electronics Forum | Sat Aug 04 07:44:25 EDT 2007 | davef
Thermal cycle* * Requirements for and troubleshooting of poor barrel fill => Hole fill
Electronics Forum | Wed Dec 19 09:24:21 EST 2012 | swag
Many times we manually add flux from the top side for good fill.
Used SMT Equipment | Soldering - Wave
2005 Speedline Technologies Vectra 450F Wave Solder Note: The solder pot is full of lead-free solder. The weight of this solder is estimated at 1600 lbs. Item Location: Westerville, OH USA Serial: 498509 Features: Ultra Fill Lead-Free OptiFlux II Int
Used SMT Equipment | Soldering - Selective
Vintage: 2007 Details: • Leaded-currently filled with solder • Single Pot • Topside Preheat • Nitrogen capable • Set up camera • Spray fluxer • 3 nozzles included Condition: Complete & Operational Location: LCI FL / FOB origin
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Parts & Supplies | Pick and Place/Feeders
filling clip /16-88 PSA 10 pcs
Parts & Supplies | Pick and Place/Feeders
SM FEEDER smt feeder cart for samsung Product Name:SAMSUNG SM smt feeder storage cart Dimensions(mm):930*600*1170 Product Description:40 / Layer, 2 Layers Uses: For placing feeder,feeder preparation in advance,Feeder Turnover store,Increase p
Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Thu Jun 06 00:00:00 EDT 2024 - Thu Jun 06 00:00:00 EDT 2024 | Querétaro, Mexico
Querétaro Expo & Tech Forum
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
Career Center | Edina, Minnesota USA | Technical Support
SMT Operator - Minneapolis, MN. RWJ is currently looking for individuals with pick and place machine experience and IPC 610 soldering certification. This individual would be operating Juki equipment, working first shift, and working for a first rat
Career Center | Lincoln, Arkansas USA | Production
EMS, Inc is a contract manufacturer specializing in printed circuit boards and cable assembly. We are currently seeking hard-working, detail oriented individuals interested in full-time work. Seeking to fill several positions including: Test Tech
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
This cell contains DSP_TRAILER.CFM. This is a layout/formatting test. Eventually, useful content will fill this area.
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
GPD Global | https://www.gpd-global.com/trench-filling-dispensing-auger-pump.php
Trench Filling Dispensing Auger Pump Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-via-terms-and-applications_topic1596.xml
: a technology that allows to design VIP (via in pad) because of flatness surface. Copper via filling as resin via filling plus copper capping are the two main technological solution available today. Solder Mask Covered: a pad or via (via tenting
