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Pan Pacific 2011 Call for Abstracts

Industry News | 2010-08-17 13:31:00.0

The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!

Surface Mount Technology Association (SMTA)

New Product Innovations in Electronics Manufacturing Light Up at Electronics Midwest

Industry News | 2010-09-22 14:57:12.0

Sparking new ideas to innovate and offering new solutions to challenges in the electronics assembly and printed board industries, the exhibition at Electronics Midwest will take place September 28–30, 2010, at the Donald E. Stephens Convention Center, in Rosemont, Ill.

Association Connecting Electronics Industries (IPC)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2017-06-08 15:11:11.0

The SMTA is pleased to announce that the program for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai and registration is open. Taking place September 17-21, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Surface Mount Technology Association (SMTA)

Design Innovations and Best Practices at IPC APEX EXPO 2012

Industry News | 2011-12-07 20:56:54.0

Innovations and best practices will be featured in the IPC Designers Forum and design-focused courses at IPC APEX EXPO 2012, February 26-March 1, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

IPC Releases 2000/2001 Technology Roadmap

Industry News | 2001-02-13 08:23:07.0

IPC has announced the release of The 2000/2001 National Technology Roadmap for Electronic Interconnections. This roadmap provides a vision and direction for product development, process development and services required to satisfy the current and future needs of companies building electronic equipment.

Association Connecting Electronics Industries (IPC)

Standards Development Committees Advance Leading Industry Standards at IPC APEX EXPO

Industry News | 2015-01-22 11:41:32.0

Hundreds of experts from around the world will discuss electronics manufacturing standards in more than 90 standards development meetings February 22–26, in conjunction with IPC APEX EXPO in San Diego.

Association Connecting Electronics Industries (IPC)

Embedded Component Technology on the Rise Joint IPC/FED Event to Address Critical Technology and Business Issues

Industry News | 2013-05-06 18:48:35.0

IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.

Association Connecting Electronics Industries (IPC)

IPC STANDARDS MEETINGS AT IPC APEX EXPO ESTABLISH BENCHMARKS FOR ELECTRONICS MANUFACTURING INDUSTRIES

Industry News | 2013-02-12 13:27:55.0

Hundreds of experts from around the world will discuss electronics manufacturing standards in more than 80 standards meetings February 16–22, in conjunction with IPC APEX EXPO® in San Diego.

Association Connecting Electronics Industries (IPC)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

Changes in Key Electronics Manufacturing Standards Focus of Half-day Workshops at Electronics Midwest

Industry News | 2010-08-25 14:54:48.0

Industry experts will shine the spotlight on recent revisions to key electronics manufacturing industry standards and guidelines during IPC’s professional development program at Electronics Midwest. On September 27 and September 29–30, half-day, in-depth workshops will address major updates to the standards that establish electronics manufacturing requirements and acceptability criteria worldwide. In addition, a workshop covering industry best practices, new and emerging developments and future trends in materials and processes for packaging and assembly will be offered.

Association Connecting Electronics Industries (IPC)


flex cicuit assembly process searches for Companies, Equipment, Machines, Suppliers & Information

Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155

2024 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Throughput Reflow Oven
PCB Handling Machine with CE

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