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Ceramic PCB 3 China manufacturer

Ceramic PCB 3 China manufacturer

New Equipment |  

sales5_etlimited_cn china ceramic pcb,china ceramic pcb single layer key speciafications/special features: Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4BK, F4BT, TP, PF, FR4, FR1, FR2, CEM-1, CEM-3, etc. pcb Board thickness: 0.30 to

ET Limited

PCB assembly Card read device

PCB assembly Card read device

New Equipment |  

sales+etlimited+cn china pcba supplier,china card read pcba supplier,china 8 layers pcba(pcb assembly) supplier key speciafications/special features: 8 layers PCB Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4BK, F4BT, TP, PF, FR4, FR1,

ET Limited

PCB assembly China professional manufacturer

PCB assembly China professional manufacturer

New Equipment |  

sales5_etlimited_cn Aluminium PCB,single sided PCB,China PCB&PCBA manufacturer key speciafications/special features: 8 layers PCB Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4BK, F4BT, TP, PF, FR4, FR1, FR2, CEM-1, CEM-3, etc. Board th

ET Limited

Single sided PCB

Single sided PCB

New Equipment |  

1) Single Sided PCB 2) Material ranges: FR-1, 94VO/HB, 22nf, CEM-1 and CEM-3, FR-4 3) Copper weight: 1-2 oz 4) Profile: Punch 5) Thickness: 0.8mm-1.6mm 6) Surface finish: OSP, HASL, Immersion Gold

Bicheng Enterprise Company

cem3

Electronics Forum | Fri Oct 05 09:15:23 EDT 2001 | Ben Bierlein

It is a PCB material that has a woven glass / epoxy internal core and glass veil surface. It is in between the paper materials (FR1,FR2 and CEM1) and FR-4 as far as strength and cost. It is available in HiCTI material for high power applications.

material of laminates of printed circuit board

Electronics Forum | Thu Feb 03 06:21:57 EST 2000 | Ignacio Simon

I would like to have information about the materials commonly used for laminates of printed circuit boards, their main thermal, mechanical, humidity and electrical characteristics and proper finishing and aplicattions, and advantages/disadvantages be

Higher TG for PWB when soldering Lead Free (?)

Electronics Forum | Mon Mar 08 19:52:54 EST 2004 | Ken

I have processed the following materials in lead free processes: CEM FR1 FR4-120 FR4-140 FR4-170 Each material has different responses to thermal stresses. Issues to consider are: Panel size, smt only, wave only, double sided smt...and smt / wave

Silver Thru' Hole

Electronics Forum | Thu Apr 27 04:41:48 EDT 2000 | Scott Davies

Our R&D people are looking at the possibility of "Silver Through Hole" as an alternative to "Plated Through Hole" for our future PCB specification. Do any of you have any experience of this, advantages/disadvantages, etc. I'm told that the main reaso

Re: Silver Thru' Hole

Electronics Forum | Thu Apr 27 21:00:32 EDT 2000 | Dave F

Scott: I�m not familiar with some of the things you�re talking about, but let me: * Agree with Russ & Peter regarding immersion silver. * Give some snips of information on the substrate side of things that might help you to tie this together. � FR-1

Rephrase : mixed technology criteria.

Electronics Forum | Sat Oct 09 09:50:04 EDT 1999 | Ken Fong

Hi, We are using mixed technology in our PCBA. Would like to know whether there is any criteria governing/guiding the use of mixed technology in such aspects as: 1. Some SMDs cannot be used in some kind of PCB materials such as FR1? 2. Some SMDs are


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