Full Site - : glue procedure (Page 1 of 4)

T&H   Electric iron sealing glue robots

T&H Electric iron sealing glue robots

New Equipment |  

1. Using two large-capacity feeding system, double heads and synchronous operations increase productivity 2.CCD assisted with the programming function, According to oneself products can be pre-set number of enforcement procedur

cixi tianhao dispensing equipment co.,ltd

Kanghongjin Kapton tape

Kanghongjin Kapton tape

Parts & Supplies | Tape and Reel

Kapton tape Discriptions: 1. We can according to customer's request and mode making to order. Accept OEM. 2. In the SMT process, the backflow stove measured when furnace temperature glues the thermocouple wire; 3. In the SMT process, uses in gluing

Shenzhen Kanghongjin Electronic Co.,Ltd.

LPKF ZelFlex Clamping Frame for Solder Paste Stencils

LPKF ZelFlex Clamping Frame for Solder Paste Stencils

Videos

The LPKF ZelFlex Z4P is a pneumatic 4-sided high-speed clamping frame for stencils. More information: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/quick-release-frames/zelflex-z4p.htm?utm_source=youtube&utm_medium=social&utm_term=s

NET DIGITAL SERVICE SRL

Using Automatic and Semiautomatic Pick-and-Place Systems in Parallel Proves a Successful Strategy

Industry News | 2011-04-07 20:39:13.0

Combining an automatic SMD pick-and-place for series production with a semiautomatic placer for prototyping proves beneficial. A universal data interface developed by Essemtec ensures an easy, secure transition from prototyping into production and avoids confusion about data versions.

ESSEMTEC AG

ASM Assembly Systems at the SMT Hybrid Packaging 2013 show

Industry News | 2013-03-12 13:42:20.0

With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.

ASM Assembly Systems GmbH & Co. KG

Re: Apply glue with a stainless stell stencil

Electronics Forum | Sun Feb 13 19:04:13 EST 2000 | Jackie Hsieh

First I'm a Taiwanese people so excuse my bad english writing. On my experience, The process of double side SMT procedure with two methods ---First one is appling the glue on the solder side, and placeing the R,C,L chips components on it.and 2nd one

Surface Mount Component Glues

Electronics Forum | Mon Oct 16 11:53:35 EDT 2000 | Howard C. Ohlhous

I would like to know what type of glue is used to hold down surface mount devices to boards before/during solder reflow. I would like to obtain said glue for evaluation and possible use in an assembly procedure. Please Advise: What company manufactur

Cleaning of stencil

Electronics Forum | Tue Apr 20 20:33:38 EDT 2004 | davef

You're correct, alcohol can cure or cause reactions in epoxies. While you're waiting for others to reply: * Read your glue supplier's application notes. They often discuss cleaning procedures and materials. * Consider searching the fine SMTnet Arch

O-Ring

Electronics Forum | Mon Aug 21 11:15:31 EDT 2006 | aj

All, We have a conveyor that uses an o-ring belt , this belt breaks quite regular which causes a hassle for the SMD Ops. The stuff we use is from Radionics,its 3mm also. Anybody recommend a good belt or procedure for joining them together( we curr

Universal GDM users?

Electronics Forum | Tue May 20 11:09:30 EDT 2003 | JB

Hello Gav, We have tried the procedure that you described, and it didn't work well for us. Even though the viton tubing is doubled up and pinched, no amount of glue is visible at the tip of the tubing. So getting the glue to protrude from the syring


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