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Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F

Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b

Re: Process Characterisation

Electronics Forum | Thu Nov 30 04:02:26 EST 2000 | Chris May

Michael, Thanks for your response. More info:- The processes are as follows, Stencil Print (6 thou on DEK 248) Placement on Contact 3AV and Reflow on BTU 4 zone Top & Bottom oven.It is not an In-Line system. Our board technology is mixed but heavi

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F

Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b

Solder Balls

Electronics Forum | Tue Feb 13 07:26:26 EST 2001 | doctord

Bill, I can give you suggestions. First and foremost. Print a board and look under a microscope. Are you printing exactly on the pads? If you print on the mask, no matter how good we got the profile, no matter what paste we would get solder balls. Mo

Tantalum influence on other components

Electronics Forum | Wed Jan 17 03:52:20 EST 2007 | Vladimir

Hi, I am process engineer of SMT production. We have some strange problemn with tantalum capacitors. 1 case: If tantalum capacitor placed near BGA and one of his legs is connected to one of the BGA balls, after reflow we can see short between two or

Solder Joint

Electronics Forum | Tue Jan 30 09:26:59 EST 2007 | CK Flip

I think most people don't "get" soldering, and advocate the "more-is-better" approach as if solder were duct tape - you know...the more duct tape you put on something the stronger the bond. Such is NOT the case with soldering. People don't "get" that

Expected pick and place precision for 0603 LEDs?

Electronics Forum | Tue Nov 12 17:11:32 EST 2013 | mondalaci

Hi Folks, I'm working on a LED display that is composed of multiple layers. What is interesting for the point of this discussion is the PCB layer and the light deflector layer on top of it. Please take a look at the related pictures at http://plus

QFN/BTC Pad Configuration Commonality for Solder Stencils

Electronics Forum | Tue Apr 30 10:29:42 EDT 2019 | spoiltforchoice

Well to some extent, but with QFNs, device manufacturers seem to have really gone to town with inventing new shapes and sizes. So while you could certainly generalize a bit with QFPs with common shapes like a TQPFP100 for instance; thats harder with

Koh Young Fiducial error multi-up panels

Electronics Forum | Mon Jun 10 14:10:08 EDT 2019 | griinder

I am able to create a single board program using gerber and centroid, and teaching footprints. I can then assign 2 global fids(a third never seems to display in Ceditor), and export my pad file. I then open it in ceditor and export the job file. Load


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