Inspection and Data Creation Tool for the Stencil / Screen Fabrication Industry. World's leading solder paste stencil & emulsion screen inspection system. Used by both stencil/screen fabricators and users to detect errors BEFORE production, elimina
New Equipment | Cleaning Agents
Full-Strength Maintenance Cleaner/Stripper. CYBERSOLV® C8544 is a solvent cleaner and stripper designed to be used in immersion and manual cleaning applications. Easy to use, C8544 is applied as received and heated in a well-ventilated tank.
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Mon Jun 26 08:08:32 EDT 2006 | davef
It does make you think the immersion coating is causing the voiding, doesn't it? We never have seen that.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2003-04-10 10:27:46.0
IPC and JEDEC Send Out Call for Papers
Technical Library | 2018-07-11 22:46:13.0
For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
Cost of Gold, Copper, Palladium, Silver, tin etc Protective coatings and effects of soldering operations Solderability reflow wetting patterns Solderability tests: Dip and inspect, wetting balance, rotary dip test Simple
Lewis & Clark | https://www.lewis-clark.com/thankful10/
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