Electronics Forum | Fri Nov 03 21:16:40 EDT 2023 | calebcsmt
Depending on the assemblies you're producing, I highly recommend 8.9HF from Indium for a low residue SAC305 alloy. We have been using this for years in our NC process and residues are very little, with appropriate stencil apertures and paste printing
Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289
This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i
Electronics Forum | Wed Apr 22 23:25:15 EDT 2009 | jandon
We were using AIM WS485 SAC305 and AIM NC257 SAC305 and we had problems with voiding and AIM�s narrow process windows. Now we are using Indium3.2 and Indium8.9 with much better results.
Electronics Forum | Fri Feb 24 15:15:33 EST 2006 | russ
The No-Clean indium lead free paste runs well. We discontinued because of extremely high shipping costs. We can get the same results with cheaper product. Almost all of the discussion in this forum about SAC305 and SN100C have to do with wave sold
Electronics Forum | Wed Apr 22 14:34:13 EDT 2009 | Quijano
Just to add a comment, we were using AIM Lead Free (SAC 305/ NC254 & 257) in the past and we had Voiding problems, then we tried Indium 8.9 HF, and we have better results, so now we are evaluating change to Indium for many of our products.
Electronics Forum | Fri Feb 24 13:49:11 EST 2006 | yiannis
Seeing the threads about lead free I realise that all write about SAC305 and SN100C. None about paste with Indium . Why ?
Electronics Forum | Tue Jul 12 04:21:29 EDT 2005 | Chris Ong
Hi, Have anyone out there been using Asahi products. My knowledge is limited and I only know it from the http://www.asahisolder.com website. Pls feedback or share your view on the Asahi product. If this product worked better than other even if it h
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Sun Feb 18 16:47:34 EST 2007 | darby
As I stated, the reply was direct from Indium, (thanks to Rich Brooks). The information regarding cool down rates should come from your paste supplier; not an oven supplier; not a generic article on lead free. I just went through the data sheets from
Electronics Forum | Tue Jun 05 20:46:25 EDT 2007 | rfrog
I, too, have finished qualifying the Amtech paste for a dispensing application. We will be experimenting with the component soldering/stencil printing next. The stuff has proven to provide the best of both the no-clean/low solids and water washable
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