Industry Directory | Manufacturer
Prot Ar-Ge introduces its new and unique product FADOS7F1 Fault Detector, Circuit Analyser, VI Tester, PC Oscilloscope without any equivalent in the world; at protarge com.
Industry Directory | Consultant / Service Provider / Manufacturer
Lepla srl electronic contract manufacturer, specialized in the SMT & THT Electronic Cards Assembling, Wiring Assembling Harness, In-Circuit, Parametric and Functional Testing.
40 dB typical Equivalent source match: > 25 dB typical For More Products or Product Info Visit: http://www.recontest.com/ To Buy This Equipment Today Visit : http://cgi.ebay.com/ws/eBayISAPI.dll?ViewItem&item=151349145819&ssPageName=STRK:MESE:IT
New Equipment | Test Equipment
The Huntron Tracker 2000 provides advanced troubleshooting capabilities to simplify testing newer technology components such as CMOS and MOS circuits. Its built-in pulse generator lets you thoroughly troubleshoot gate-fired devices such as SCRs, TRIA
Electronics Forum | Tue Jul 27 13:50:52 EDT 1999 | Mike Konrad
Aqueous Technologies manufactures the Zero-Ion ionic contamination tester. The Zero-Ion utilizes dynamic-based technology and has been assigned the highest equivalency value by the NAWC. It is among the most sensitive of all of the military-approved
Electronics Forum | Mon Jul 26 17:21:20 EDT 1999 | Tom Terlizzi
any advice on ionograph testing in the 1 microgram/cm^2 for small devices. We have a old Alpha 500 series machine that is dead but ALpha doesn't service this vintage machine.Any other way to perform this test, or a third party vendors to service th
Used SMT Equipment | Pick and Place/Feeders
Model:YG300 SMT machine Placement Speed:105,000cph(0.034sec/CHIP Equivalent ) Placement Range:0402(Metric base )to□14mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L2770XW2118 Weight:4.400kg if need more info about the products , pls don
Used SMT Equipment | SMT Equipment
YG200 SMT machine Model:KET-100 Placement Speed:45,000cph(0.08sec/CHIP Equivalent) Placement Range:0402(Metric base )to□14mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L1950XW1408 Weight:2080kg if need more info about the products , pls d
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2018-09-23 09:57:15.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Technical Library | 2023-04-25 22:03:25.0
This report hopes to achieve several goals: 1. Determine the link between bare PWB contamination, soldered assembly contamination and long-term product reliability. 2. Establish measurable limits for bare PWB cleanliness as well as process control limits for both an aqueous as well as a water-soluble soldering process. 3. Determine whether there is any correlation between common, industry-accepted rose/modified rose (omegameter/ionograph type) testing and long term product reliability. 4. Determine the effect PWB plating finish (HASL, Immersion Silver and Cu OSP) has on both bare PWB contamination as well as soldered assembly in a no clean and water soluble process. 5. Determine whether there is a link between percentage of saponifier used to wash soldered assemblies and long-term reliability. 6. Establish a more cost-effective test for manufacturers to use as a process-monitoring tool.
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ML-2500S PCB Separator uses high speed rotation milling cutter to separate PCB array. Widely applied in digital, communication, lighting, etc. Which improved the defect on PCB separating caused by manual, V-cut, stamping, etc If you have any questi
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Tue Feb 18 00:00:00 EST 2020 | ,
Corrosion Testing For Electronic Equipment
Career Center | Rolling Meadows, Illinois USA | Production
Family-oriented specialized PCB test, rework and repair facility seeks several highly skilled technicians. If you are highly skilled then come work with among the best soldering and PCB test and repair technicians in the US. Relevant Work Experience
Career Center | Gaithersburg, Maryland USA | Engineering,Production
Test Engineer Design hardware and software solutions required to test data communications products in a low-medium volume, high-mix production test environment. Design and build test fixtures to support these solutions. Support Production Test d
Career Center | Bronx, New York USA | Production,Technical Support
90% of my working experiences, are related with SMT environment: I been dealing with a lot different situation for the last 16 + years. I'm a handyman person as well. know to handle power and precision, etc. For the last year and a half I been in cha
Career Center | Bangalore, Karnataka India | Maintenance,Management,Production,Purchasing,Technical Support
Having 6+ years of experience in Production Process, Production Assembly,AOI, Reflow profiling and Product costing. At present working for Navsemi Technologies as an Production Lead.
| https://www.wesource.com/test-and-measurement-equipment/agilent-4395a-network/spectrum/impedance-analyzer-10-hz-500mhz-id-001540-9/22/
Samsung Feeders Fluid and Epoxy Dispensers Hand Tools ICT/In-Circuit Test Lead Formers and Cutters Material Handling Equipment Microscopes and Accessories Miscellaneous Optical and Laser Ovens PC Board
