New Equipment | Assembly Services
China Double Sided Circuit Boards Fabricaiton and Assembly PCBA Turnkey Manufacturer 2 Layers circuit boards PCB FR4 1.6mm PCB fabrication and assembly 1oz PCB copper thickness Shenzhen PCB and PCBA manufacturer China turnkey contract electroni
Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT
I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT
Industry News | 2010-11-04 13:44:37.0
Industry-leading associations IPC and SMTA jointly announce the keynote speakers for the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, IL.
Industry News | 2010-04-10 02:37:34.0
IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas.
Technical Library | 2021-12-16 01:48:41.0
Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.
BEST, Inc. is an authorized IPC Training Center and offers the IPC-A-610C Certified Instructor Program. Students who complete the program are considered Class "A" Instructors and are qualified to teach the 2 day Worker Proficiency training and certif
BEST, Inc. is an authorized IPC Training Center and offers the IPC-A-610C Certified Instructor Program. Students who complete the program are considered Class "A" Instructors and are qualified to teach the 2 day Worker Proficiency training and certif
Career Center | Clinton, Connecticut USA | Production
Argo EMS is a well-established and growing electronics assembly shop. We are seeking an SMT pick and place machine operator. Training is available for enthusiastic quick learners with a positive attitude. Higher salary for experience programmin
Career Center | , | Production
Position Description: Wave Solder Operator Reports to: Production Manager Department: Manufacturing Job Description: Wave Solder Operator Responsibilities: � Operate wave-soldering machine. � Insure that established process c
Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution News Forums Equipment Mart Company Directory Event's Calendar Career Center Advertising Thermal Residue Fingerprinting: A Revolutionary Approach
| https://www.eptac.com/blog/the-importance-of-ipc-a-610-certification
The Importance of IPC-A-610 Certification Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc2221-2222-and-throughhole-pad-stacks_topic2586_post10872.html
uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. Military & Medical This affects the CAD library Through-hole packages due to the pad stack construction must meet or beat the IPC-610 rules for Annular Rings, Plane Clearance, Inner Layer Pads, Thermal Relief
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