This video describes what the IPC-J-STD-001 training program and the document for assembling printed circuit boards. In this video BEST Inc describes the assembly standard and what it entails . It also describes what the training program is. Operato
Industry News | 2009-03-05 15:12:58.0
ITASCA, IL � March 2009 � Kester is proud to announce that Peter Biocca and David Scheiner will hold a technical session titled �PCB Metalization� at the upcoming APEX Conference and Exhibition. Biocca, Kester's Senior Market Development Engineer, will be the moderator at the conference, which is scheduled to take place on Wednesday, April 1, from 10:15�11:45 a.m. in the South Pacific room.
Industry News | 2014-02-13 16:26:07.0
Gen3 Systems Limited today announced that they will exhibit at National Electronics Week (NEW) ADEC Expo South Africa, scheduled to take place March 11-12, 2014 at the Gallagher Convention Centre in Midrand, Johannesburg. Quamba Technologies, Gen3’s South African Distributor, will be exhibiting alongside Gen3 and will be displaying the European Product of the Year, the Gensonic Stencil Cleaning system.
Industry News | 2012-01-26 23:09:03.0
Torenko and Associates recently sold Houston-based Mesa Engineering the first IBL In-Line Vapor Phase with Vacuum in Texas. The system was installed in mid-January 2012.
Industry News | 2013-03-12 14:06:44.0
Essemtec Brazil is substantially expanding its sales and service organization in Brazil to provide the highest level of quality in all aspects of its business.
Industry News | 2011-06-20 18:39:34.0
Two years ago, the Swiss company Essemtec AG entered the Brazilian market directly. By founding Essemtec Brazil in Sao Paulo, the Swiss family business invested in one of the worldwide leading future markets for electronics. Florian Schildein recently spoke with Patrick Greuter, Area Sales Manager of South America, and Roberto Cardozo, Managing Director Essemtec Brazil, about the development of the subsidiary and its prospects.
Electronics Forum | Thu Jan 06 08:03:47 EST 2005 | davef
On solder in vias: It looks like the via are not solder masked well and pick-up solder either: * Solder coating ... OR * During leveling It's possible that the design specifies openings in the solder mask for these via. On solder in the unsupporte
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Electronics Forum | Wed Apr 21 19:09:10 EDT 1999 | Earl Moon
| | Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proc
Electronics Forum | Wed Apr 21 17:11:05 EDT 1999 | Earl Moon
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
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