Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
New Equipment | Cleaning Equipment
Feature: Adopting non-contacting technology to clean the PCB, to eliminate nonviscous dust without contaminating the PCB and the surroundings; Free consumables, low cost; Conveyor width can be adjusted automatically. Automatic PCB Cleaning Mac
Electronics Forum | Wed Mar 08 14:11:38 EST 2006 | mholz
I am looking for an industry standard �stock� note to place on our printed circuit board assembly drawings that will capture a level of cleanliness for an IPC-A-610 class 2 board assembly. I�m looking for some quantitative spec for cleanliness that w
Electronics Forum | Wed Nov 28 02:43:00 EST 2007 | philip_yam
Hi all, For leadfree HASL finish, is there any specification or guidelines for contamination level, esp Cu% to refer? How can we ensure the HASL finish composition is reliable for assembly? Thanks..
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Industry News | 2003-06-04 09:11:10.0
Concoat Systems has further expanded and enhanced its CM range of contamination testers (or contaminometers).
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems/aw-series
Related Information AW SERIES C‑SAM Spec Sheet AW SERIES C-SAM Brochure AW™ SERIES C‑SAM® Operator-Free Wafer Inspection, Analysis and Sorting The AW™
| http://www.thebranfordgroup.com/dnn3/Auction/KING0423.aspx
contamination. Risk of loss on any Goods shall pass to the Buyer upon payment in full to TBG of all sums due from Buyer in respect to the Goods. 8C. Small Lot Removal. TBG shall have no responsibility whatsoever for any missing or lost items that can be removed
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