Used SMT Equipment | In-Circuit Testers
0dBm Spectral Power Density between 1520nm - 1620nm: >-42dBm/0.1nm Applicable fiber: SMF 9/125 um Operating Time approx: 3.5 hrs on NiMH AA rechargeable batteries. - See more at: http://www.testequipmentconnection.com/44020/JDSU_OBS-
Parts & Supplies | Assembly Accessories
Fuji H5304A BOLT HEX SOCKET Fuji H5302A BOLT HEX SOCKET Fuji H5300A BOLT HESOCKET Fuji 1l5298A BOLT HEX SOCKET Fuji H5297A BOLT HEX SOCKET Fuji H5293A BOLT HEX SOCKET Fuji H5291A BOLT X SOCKET Fuji H5289A BOLT X SOCKET Fuji H5285A BOLT X SOCK
Technical Library | 2014-01-09 16:40:33.0
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology have a great potential for high frequency and high density applications. It also provides better signal performance, reduced parasitic and cross talk. This paper summarizes the selection of resistor embedded materials, evaluations of resistive material (Phase 1) and duplication of a complex digital design (Phase 2). Phase 1 –resistive materials (Foil 25Ω/sq NiCr and 1kΩ/sq CrSiO) and resistive-Ply materials (25Ω/sq and 250Ω/sq NiP) were chosen for evaluation.
Technical Library | 2017-06-01 17:12:08.0
The corrosion of Nickel-Palladium-Gold (Ni-Pd-Au) finish terminals in humid environments is known to be reduced with the application of a conformal coating such as acrylic. Corrosion has a higher rate of occurrence around the terminal ‘knee’ of a surface mount component, which may be reduced with the application of conformal coatings. Although radio frequency (RF) plasma processing is generally known to enhance conformity of conformal coating to surfaces through ionic bombardment, the effect on the functionality of assembled printed circuit boards (PCB) is not as well known. The purpose of this study is to assess whether RF plasma processing can enhance the adhesive and coverage qualities of an acrylic conformal coating on PCBs, specifically on Ni-Pd-Au terminals with a knee, and if plasma processing has an effect on the electrical functionality of components and fully assembled PCB.
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
Parts & Supplies | General Purpose Equipment
Our conductive non-woven fabric is plated Cu+Ni on non-woven fabric,it has good conductivity and shielding effectiveness,it is widely used in various electronic products.The thickness of our non-woven fabric is 0.035mm,0.045mm,0.04mm,0.08mm,0.10mm,0.
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Parts & Supplies | SMT Equipment
Yamaha ABS Battery KS4-M53G0-100 3.6V 2000mAh (Ni-Cd Battery) Our company is professional Supplier & Manufacturer of SMT(Surface Mount Technology） Spare Parts ,if you have any needs,please contact us in these ways: ZK Electronic Technology C
Suitable for all linear and compact lamps, 1 h or 3 h duration. Emergency lighting module to be used with Standard or Self testing facility. Operating from NiCd or NiMh batteries, 1 hour and 3 hour duration. HFE-MULTI incorporate five pole tech
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