Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).
Origin: China Price: To Talk About Specification: 1)Thickness Of Silver Plating:From 2Um-15Um 2)Material:ABS or PBT 3)Cu-Ni-Silver 4)Earth Module,Profile Module,Profile Switching Module,Disconnection Module,Connection Module 5)Different Colors are
Technical Specifications Memory : 18,000 readings per channel Sampling interval : 0.05 sec to 10 min Accuracy : �0.5�C Resolution : 0.1�C Max internal operating temp : 85�C Data collection : start Start/stop buttons, time or temperature trigger B
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
Industry Directory | Consultant / Service Provider / Manufacturer
Numerical Innovations develops software tools for PCB, MEMs, IC, Microwave/RF, and optical components - with tools like DFM Now! and FAB3000 that are revolutionizing the way in the PCB Industry.
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
Parts & Supplies | Storage Equipment
Battery Specification Battery Type Li(NiCoMn)O2 Battery Pack 1. Basic Information Serial Number ZBL-HY001K 48V10A Connection Type 13S4P Dimension(L*W*H) 360*130*65mm Weight ≥5kg 2. Battery pack(cell) Technical Datas Battery Model 18650/260
Parts & Supplies | Adhesive Dispensers
Battery Specification Battery Type Li(NiCoMn)O2 Battery Pack 1. Basic Information Serial Number ZBL-HS001K 36V13.6A Connection Type 10S4P Dimension(L*W*H) 360*130*65mm Weight ≥5kg 2. Battery pack(cell) Technical Datas Battery Model 18650/3
Pure tungsten sheet, plate, tungsten alloy sheet, plate. Alloy Sheet(thickness) W1 0.5-8.0 CW1 0.5-8.0 W2 0.5-8.0 WAl1 0.5-8.0 WAl2 0.5-8.0 WAl3 0.5-8.0 WCe15 0.5-8.0 WTh7 0.5-8.0 WTh10 0.5-8.0 WTh15 0.5-8.0 Wl10 0.5-8.0 W-Ni-Fe 0.5-8.0
Tungsten and Tungsten Alloy Bars&Rods Alloy Bar W1 ����2.0 CW1 ��2.0-5.0 W2 ����2.0 WAl1 ��2.8-11.0 WAl2 ��2.8-11.0 WAl3 ��2.8-11.0 WCe15 ��1.0-10.0 WTh7 ��0.8-2.8 WTh10 ��2.8-10.0 WTh15 ��2.8-10.0 Wl10 ��2.8-10.0 W-Ni-Fe ����5.0 W-Ni-
