Industry News | 2014-02-19 16:09:53.0
Essemtec will debut its new SMT production centre in booth #851 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2014-01-29 02:29:02.0
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will debut its new SMT production centre in booth #851 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and mount components in one machine.
Industry News | 2014-04-07 17:54:09.0
The Balver Zinn Group announces it will attend SMT/Hybrid/Packaging 2014, scheduled to take place May 6-8 in Nuremberg, Germany.
Industry News | 2014-02-26 14:17:03.0
Nordson YESTECH will feature its market leading Automated Optical (AOI) and Automated X-ray Inspection (AXI) systems in Booth #2025 at the upcoming IPC APEX EXPO.
Industry News | 2014-03-19 13:27:35.0
Koh Young America and Koh Young Technology (Seoul, Korea) will demonstrate exciting new breakthroughs in PCB inspection at IPC/APEX 2014 in Las Vegas, Nevada this coming week.
Industry News | 2014-04-16 09:02:14.0
Europlacer announces that it will showcase the new Lzero3, along with the iineo-II and Speedprint SP710avi, in Booth #B-1C25 at NEPCON China, which is scheduled to take place April 23-25, 2014 at the Shanghai World Expo & Exhibition Convention Center (Hall 1) in Shanghai, China.
Industry News | 2014-10-13 09:31:03.0
Techcon Systems announces that it will showcase its range of industry-leading dispensing solutions in Booth #344 at The ASSEMBLY Show from October 28-30, 2014 in Rosemont, IL.
Industry News | 2014-10-22 18:30:05.0
Vi TECHNOLOGY will exhibit in Booth 4C16 with its representative, Fenwick Iberica S.A., at Matelec 2014, scheduled to take place Oct. 28-31, 2014 at Ifema - Parque Ferial Juan Carlos I in Madrid, Spain.
Technical Library | 2014-03-27 14:50:01.0
Because of the phase out of CFC's and HCFC's, standard solder pastes and fluxes evolved from RA and RMA fluxes, to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices.
Lead-Free, no-clean, water soluble Universal no-clean solder pastes that conform to customer processes as well as environmental regulation. Cookson Electronics offers a full line of all-around ALPHA� solder pastes that covers the complete range o
