PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/when-should-a-pad-use-windowpane-paste-mask_topic2600_post10599.html
(regardless of the method used to achieve this), and by how much the mask should be reduced? It seems there must be some formulas or rules of thumb used to balance the solder load applied to the various pads of an arbitrary package design
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This was not the case; the results show a uniform data spread for the number of cycles to failure for both void size populations, with no distinctly different groups for either the tin/lead or lead-free solder alloys. Study #3: D. Kim et al
