Original Solutions is a company dedicated to developing new methodologies and products to improve the overall efficiency and effectiveness of any electronics assembly environment.
Industry Directory | Consultant / Service Provider
A printed circuit board design service bureau located in the great Pacific Northwest. We specialize in large, complex, fast turn designs common in the video processing and data processing industries.
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
Electronics Forum | Tue Mar 20 11:50:05 EDT 2018 | jimpat
Another option to consider is ATCO (http://www.atco-us.com/products/item/5-pro-1600-smt-reflow-ovens). Cycle time is around 5 minutes and your throughput will depend on on how many panels will fit in the 20" x 20" work area.
Electronics Forum | Fri Jul 22 16:42:50 EDT 2005 | campos
hello all, I�m experiencing problems with "warped" boards after first reflow, some of them i just can�t print side two due to this problem,,is it related only to reflow? i�m using a linear profile (225� peak / 70s time above) with a tin lead paste,t
Used SMT Equipment | AOI / Automated Optical Inspection
Capture on the fly technology 3D Fusion Lighting (RGB+White LED's) 5 megapixel color imaging 2 top-down and 4 side angle cameras Quick set-up High speed, high defect coverage Low false failure rate Programmable conveyor for boards up to 20 x 2
Used SMT Equipment | Soldering - Reflow
HEXI, Lead-Free reflow soldering machine, type RFN1020/N, s.n. 0611018, Left to Right, with 10 heating heads plus cooling head, lenght of heating zones 3365mm,max width of PCB 450 mm, width of conveyor 50 to 450 mm, height of conveyor 920 +/_ 20 mm,
Industry News | 2017-05-03 23:42:40.0
GPD Global offers a breakthrough in uniform fluid dispensing and repeatability by ensuring a consistent fluid supply to the pump regardless of reservoir size or fluid level.
Industry News | 2016-07-16 13:32:29.0
Advanced dispense technology is available for integration into your dispensing system. Continuously Volumetric, drip-and-drool free dispense technology can now be retrofitted into your dispense robot. GPD Global's Volumetric PCD pumps ensure the success of applications like underfill, LED encapsulation, solder mask, silicones, conductive ink, conformal coatings, and more. Improve your throughput and yields by retrofitting a Volumetric PCD Pump into your dispense system to simplify the dispense process.
Parts & Supplies | SMT Equipment
MPM 1014951 timing printer belt More SMT parts available H1067R A12GD25-1L-Z FUJI CP6 Solenoid valve H1068Z PCD2413-NB-D24 FUJI CP643 13 Solenoid valve H1082T RCS-242-M3-D24MP Solenoid valve H1084A SS23H-M5-D24-UPK Sensor H1124D FUJI XP242 243
Parts & Supplies | Assembly Accessories
MPM 1014951 timing printer belt More SMT belts available (Can be customized according to customer requirements) 300-5GT-23 Original belt 300-S5M-20 Original belt 460-5GT-12 Original belt 580-5GT-22 Original belt 00329739-01 Siemens Original b
Technical Library | 2022-10-31 09:01:25.0
Delivery Time: 1-2 Days Attributes: Original New Material: Metal Shipping Ways: DHL, FedEx, TNT, UPS, By Sea,DDP Dedicated Line Color: Black Certification: ISO
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
SLIM KIC 2000 SPECIFICATIONS: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ON DEMAND | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Wed Feb 19 00:00:00 EST 2020 | Las Vegas, Nevada USA
IPC & WHMA Wire Harness Manufacturing Conference
Career Center | Tampa, Florida USA | Engineering,Production
Plans manpower, facility and equipment needs based on production schedule.* Sets goals and monitors assembly and/or test schedules.Trains personnel, either personally or through group leaders/work directors, in effective equipment and material handli
Career Center | Tallahassee, Florida USA | Engineering,Quality Control
TeligentEMS is an electronic contract manufacturer(CM) located in Tallahassee, FL. The Quality Engineer provides technical, administrative and supervisory support to the company' quality systems, process control systems and quality assurance personn
Career Center | Shenzhen, China | Technical Support
We design and manufacture automatic machine for the PCB/SMT and Thru-hole industries in Shenzhen China. We help companies looking to low cost equipment with smart, ROI-driven assembly equipment solutions. Email: jasonwu@smthelp.com ;w25605@gmail.com
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
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