Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Industry News | 2015-01-19 21:50:28.0
KYZEN’s innovative new product technology team is introducing its new AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry in Booth #1011 at the IPC APEX EXPO. The EXPO tales place Feb. 24-26, 2015 at the San Diego Convention Center in California.
Industry News | 2015-02-25 14:21:51.0
KYZEN received the 2015 NPI Award for excellence in the category of Cleaning Materials for its AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry. The award was presented during a Tuesday, Feb. 24, 2015 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2015-03-26 12:12:26.0
KYZEN’s will introduce its new AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry in Booth B-1D10 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. KYZEN’s team also will highlight its ultra-low VOC AQUANOX® A8830/31 stencil cleaners.
Industry News | 2015-04-21 16:27:46.0
KYZEN has been honored with a 2015 SMT China Vision Award. This year’s award recognizes KYZEN’s ph Neutral Electronic Assembly Cleaning Chemistry AQUANOX® A4708, a highly-specialized solution for low-gap PCB assembly cleaning.
Industry News | 2015-07-21 08:01:30.0
KYZEN’s will exhibit in booth #A-1P01 at NEPCON South China 2015, scheduled to take place August 25-27, 2015 at the Shenzhen Convention & Exhibition Center. KYZEN’s team will display the globally acclaimed, advanced technology AQUANOX® A4708, which already has won three industry awards since its debut earlier this year.
Industry News | 2015-08-25 10:57:24.0
KYZEN announces that it will exhibit in Booth #117 at SMTA International, scheduled to take place September 29-30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The KYZEN team will showcase its AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry and celebrate its 25-year anniversary.
Industry News | 2015-11-01 18:53:43.0
KYZEN announces that it will exhibit at the SMTA LA/Orange County Expo & Tech Forum, scheduled to take place Thursday, Nov. 5, 2015 at The Grand Event Center. The KYZEN team will be available to answer cleaning questions, and will have the AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry on display.
Industry News | 2015-11-04 20:26:00.0
KYZEN today announced that it will exhibit at the SMTA Space Coast Expo & Tech Forum, scheduled to take place Thursday, Nov. 12, 2015 at the Melbourne Auditorium in FL. The KYZEN team will be available to answer cleaning questions, and will have the AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry on display.
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