Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
New Equipment | Education/Training
IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a c
Tungsten and Molybdenum Boats Typical application Lighting Technology:lamp electrodes for creating the arc in discharge lamps, filament wire for halogen lamps, tubes for annealing filament wires, Evaporation boats for coating cold-light reflect
Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Fri Aug 23 12:35:09 EDT 2002 | msjohnston
Has anyone done a study or know of one that addresses the flow / no-flow underfill differences for CSP devices. My main interest is in the reliability of the CSP and underfill. Any help would be great. Thanks, Mike
Industry News | 2012-04-06 15:32:39.0
GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.
Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Technical Library | 2023-08-16 18:42:25.0
In one of our medical applications projects, the customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die. The substrates were Dymax X-499-91-C for Masking and Epoxibond-106M-1 for Underfill Dispensing
Technical Library | 2019-02-27 15:23:47.0
A study was performed to investigate, evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs), Leadless SMT devices, QFNs, connectors and passive devices to improve reliability. The supplier of the sole source, currently used underfill, has indicated they may discontinue its manufacture in the near future. The current underfill material is used on numerous circuit card assemblies (CCAs) at several sites and across multiple programs/business areas. In addition, it is used by several of our contract CCA suppliers.The study objectives include evaluation of material properties for down select, dispensability and rework evaluation for further down select, accelerated life testing for final selection and qualification; and process development to implement into production and at our CCA suppliers. The paper will describe the approach used, material property test results and general findings relative to process characteristics and rework ability.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
SMTnet Express, February 28, 2019, Subscribers: 31,699, Companies: 10,717, Users: 25,786 Evaluation, Selection and Qualification of Replacement Reworkable Underfill Materials Credits: Northrop Grumman Corporation A study was performed
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2271-underfill-voids
– namely, the dark center and gray outline expected of a good bond in this type of flip chip. The curved dark bands inside the void are not traces but probably ridges of underfill material
PCB Libraries, Inc. | https://www.pcblibraries.com/products/fpx/3D-STEP_SM-Passive.asp
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