Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
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Electronics Forum | Fri Jul 24 13:45:12 EDT 1998 | Bob Willis
Yes you need solder paste for BGA. Have a look at the Free BGA documents on my home page which you can download. They cover design, rework, and general assembly www.bobwillis.co.uk | My firm has just begun it's first PCB that will use BGA packaging.
Electronics Forum | Fri Sep 05 06:17:36 EDT 2014 | edriansyah
Hi, We have a problem with our BGA Pad. Our PWB manufacturer make the BGA Pad in irregular form. some big, some small. Please see the picture on attachment. BGA Detail BGA Pitch 0.5 mm BGA Ball 0.3 mm BGA Pad (big) 0.2 mm (as per gerber) BGA
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
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) Technical specification: Applicable PCB Max. PCB size 1000X800mm = 39”X 31.5” Workable area 800X1000mm Bottom preheat area 700*600mm = 27.5”X23.5” PCB thickness 0.5-5mm (Max. thickness 10mm with custom-made jig
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