Nextreme designs and manufactures manufactures micro-scale electronics cooling and energy harvesting solutions for telecommunications, semiconductor, consumer, medical, aerospace and government markets.
Industry Directory | Manufacturer
Pillarhouse is a leading supplier of selective soldering systems for single-point and multi-point soldering configured for manual loading, in-line or as multiple unit in-line systems offering topside and in-line preheat.
New Equipment | Selective Soldering
Pillar Orissa Synchrodex single Point, in line, Soldering Machine, Nitrogen generation system and vacuum packing Max.size18 x24” (257mmx610mm) min 4”x4” Dual flux assembly Top side IR pre heat with Closed loop pyrometer setting laser Windows ba
New Equipment | Solder Materials
Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (including
Electronics Forum | Sat Oct 22 13:37:46 EDT 2016 | greglac
I am currently working on a custom IC where we plan on using Cu pillars at 80um pitch. I'm am trying to narrow down a packaging solution. My requirements are as follows: 40um Line Width/Space Capability (or finer) 4 layers low loss at mm-wave
Electronics Forum | Mon Jan 28 00:48:21 EST 2002 | peterson
Being in the backplane biz, we too, encounter similar problems...especially when our customer reads the IPC as Biblical (you will achieve 75% fill or be turned into a pillar of salt). Anyway, recently, one of our process engineers suggested paste-hol
Used SMT Equipment | Soldering - Selective
Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati
Used SMT Equipment | Soldering - Selective
• Dual Pot Lead/Leadfree • Drop Jet Fluxed • Inerted Nitrogen System • One AP Solder tips • PillarCOMM Windows Software • Solder Wire Feeder • Solder Bath Level Sensor • Solder Wave Height Measurement • Black and White Camera Programming • S
Industry News | 2010-05-30 23:23:13.0
Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.
Industry News | 2010-08-17 13:31:00.0
The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!
Parts & Supplies | Assembly Accessories
SC4-M5A SPEED CONTROLLER SC4-M5A SPCON 4 M46-M8527-C0X FILTER 1 SPARE PARTS 2001.02.02 M120012 KW7-M5303-10X SW POWER DC12 1 KW7-M5126-00X SAFETY SWICTH 2 KW7-M13D7-00X SEAL 2(YAMAHA) 1 KW3-M5169-00X MOUSE 1 2002.5 KW3-M5150-11X KEYBOARD E KW
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Parts & Supplies | Pick and Place/Feeders
NXT 8MM scrap with front guide wheel PM066A2 Model: FUJI Mounter Specification: NXT 8MM scrap with front guide wheel PIN Part Number: PM066A2 Name: NXT 8MM scrap with front guide wheel PIN PM08XK3 FUJI NXT special-shaped nut PM066A2 FUJI NXT 8
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
Technical Library | 2018-01-17 22:47:02.0
Fine pitch copper (Cu) Pillar bump has been growing adoption in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities, thus assembling such packages using a standard mass reflow (MR) process and maintaining its performance is a real and serious challenge. (...) In this study a comprehensive finding on the assembly challenges, package design, and reliability data will be published. Originally published in the SMTA International 2016
Ultra-flexible, offline, multi-platform, quick load twin PCB rotary table selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to
Ultra-flexible, offline, multi-platform selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys witho
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/vision-systems
. Side Alignment Camera The side view camera is ideal for testing micro features such as copper pillars, micro bumps and TSVs. The system enables a secondary view point of feature to be tested, providing accurateand repeatable tests
Heller Industries Inc. | https://hellerindustries.com/news/heller-attends-ceia-huizhou-seminar/
. Currently, Huizhou has established a modern industrial system called “2+2+N,” with the electronic information and the petrochemical industries as the main pillars, along with development of automotive, equipment manufacturing, and clean energy industries
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