Electronics Forum: polyimide fab msd baking (11)

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Fri Oct 01 09:47:36 EDT 2010 | noid

Yes, they should be baked prior. We pre-bake all polyimide fabs, flex or not. They are prone to delam.

Moisture absorbtion in circuit boards

Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c

I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh

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