Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Thu Feb 17 09:35:16 EST 2011 | ravo
Hi everybody, I am here seeking your experience and asking your help, I want to update our SMT production line as I already hace FUJI CP6 and QP242 machines beside GL2 and oven our new product including 60 components 0402 (1mm*0.5mm ) and 2 BGAs w
Electronics Forum | Tue Aug 11 18:15:11 EDT 2009 | ysutariya
Have you looked into Sipad? They will pre-paste your BGA and other component areas with solderpaste that has an adhesive on it. You can then hand place your components and run through a reflow. Here's their site: http://www.sipad.com/
Used SMT Equipment | Soldering - Reflow
1. This product is made of imported stainless steel materials from Japan and is enclosed with the original Nano insulation materials from the United States. 2. This product has an extremely long service life. The general time is three to five years
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Used SMT Equipment | Assembly Accessories
The standard version of the XPRT 5 comes with stencil-cleaning and stencil inspection functions as well as a 2 1/2D postprint inspection capacity. The integration of closed squeegee systems (Proflow) has also been enabled. The use of an open-can cont
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Parts & Supplies | SMT Equipment
PAPER CLEAN MOTOR (181452/157373 Roll motor 181452/157373/129352. DEK roll motor BOM ^ PAPER CLEAN MOTOR, (Quality, cost-effective.) Applicable models: DEK All models if need more info about the products , pls don’t hesitate to contact with
Parts & Supplies | SMT Equipment
PAPER CLEAN MOTOR (181452/157373 Roll motor 181452/157373/129352. DEK roll motor BOM ^ PAPER CLEAN MOTOR, (Quality, cost-effective.) Applicable models: DEK All models if need more info about the products , pls don’t hesitate to contact wi
Technical Library | 2023-01-17 17:35:07.0
After years of concentration on resolving productivity- related concerns such as increasing speed, consistency and throughput while reducing costs, many of the world's leading electronics manufacturers have added a new mandate to their agendas. They are seeking to minimize the environmental impacts of their assembly processes and final products without sacrificing the high levels of productivity and quality that have been achieved through decades of effort.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Events Calendar | Wed Jul 26 00:00:00 EDT 2017 - Wed Jul 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Technical Education - Best Practices in Design
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Career Center | Westbury, New York USA | Accounting/Finance
Job Location: Tri-State NY Metro Area Suburban location Salary: $90-100K base, plus bonus and stock options Company: A +$1 billion rapidly growing electronics wireless communications manufacturer. Position Description: Are you looking fo
Career Center | Appleton, Wisconsin USA | Management
Position will be responsible for all production operations and supply chain operations of the company. You will be responsible for meeting customer delivery schedules, company contribution goals, implementing lean processes and maintaining a competi
Career Center | Mayaguez, Puerto Rico | Engineering,Production
Detail oriented and goes to great lengths to insure that the products are meeting and exceeding customer expectations. Place procedures and training in place to provide former company with techniques for ISO 9001:2008 and QS 9000. Assist design engi
Career Center | Noida, India | Maintenance,Management,Production
Over 12 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries.
Imagineering, Inc. | https://www.pcbnet.com/blog/the-cost-of-pcb-fabrication-pricing-factors/
The Cost of PCB Fabrication: Pricing Factors Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances
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