Industry News | 2016-09-01 19:24:28.0
KIC today announced that Marybeth (MB) Allen will present “Optimized Reflow Profiling to Minimize Voiding” during SMTA International. The presentation is scheduled to take place during the IPC Session ‘Lead-Free Symposium,’ Session LF2 on Thursday, Sept. 29, 2016 from 11 a.m.-12 p.m.
Industry News | 2010-09-29 23:32:58.0
Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2014-04-08 11:43:03.0
Isola Group has launched a technology-licensing program to mitigate conductive anodic filamentation (CAF) problems in the fabrication of PCBs. This proprietary manufacturing technology, which is offered by ISOLA USA Corp. "Isola USA", reduces the number of voids in resin-impregnated dielectrics, which is a major source of CAF failures.
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Industry News | 2014-04-30 13:42:31.0
Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
New Equipment | Rework & Repair Equipment
Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in
Industry News | 2012-06-25 12:49:28.0
Nihon Superior, will introduce a new product, SN100C P810 D4 low-voiding lead-free solder paste, at the upcoming IPCA International Expo, scheduled to take place July 25-27, 2012 at the KTPO Trade Centre in Bangalore, India.
Industry News | 2016-04-21 19:00:55.0
Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the International Conference on Soldering and Reliability (ICSR) 2016 on May 9-11 in Toronto, Canada. Sandy-Smith will present How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study. This presentation will include data from several studies that demonstrate how stencil design and reflow profile optimization impacts voiding levels and variation in material comparison testing.
Industry News | 2022-03-25 12:39:22.0
Since launching at the end of last year, Solderstar's innovative new thermal profiler 'SLX' has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022 Hall 4 Stand 226.
Industry News | 2022-03-25 12:40:21.0
Since launching at the end of last year, Solderstar's innovative new thermal profiler 'SLX' has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022 Hall 4 Stand 226.
