Industry Directory | Manufacturer
Production Solutions, Inc., manufacturer of the RED-E-SET Universal Board Support System for all Printers and Chipshooter, Dispensers and Placement machines.
Original Solutions is a company dedicated to developing new methodologies and products to improve the overall efficiency and effectiveness of any electronics assembly environment.
Electronics Forum | Fri Aug 01 02:10:26 EDT 2008 | fowlerchang
Pad design is not only the size of pad but also the distance between two pad. N2 will increase tombstone as we tested. 10 zones reflow oven and slow temperature ramp will reduce this defect. MustII is the equipment which is used to test the solderabi
Electronics Forum | Mon May 05 18:48:23 EDT 2003 | Kris
Hi, It is expected that lead-free will have reduced tomstoning. As it has a higher surface tension and does not wet as well as the tinlead paste it exibit lower tombstoning. Addiotnaly commercialy available lead-free alloys may not be true eutectic
Used SMT Equipment | Pick and Place/Feeders
Make: FUJIModel: FUJI AIMEXIIICDetails:1.Compact Size: The AIMEXIIIC is designed to be compact, suitable for production environments with limited space. The machine size is L: 1,280 x W: 2,346 x H: 1,465 mm.2.High Versatility: Supports placement fro
Used SMT Equipment | Pick and Place/Feeders
Make: FUJIModel: FUJI AIMEXIIICDetails:1.Compact Size: The AIMEXIIIC is designed to be compact, suitable for production environments with limited space. The machine size is L: 1,280 x W: 2,346 x H: 1,465 mm.2.High Versatility: Supports placement fro
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2014-02-03 14:13:04.0
FCT Assembly is pleased to announce that it now offers a variety of anti-tombstoning solder pastes as an option with each of its solder paste fluxes.
Parts & Supplies | Pick and Place/Feeders
Starting in May 2008, ＪＵＫＩ Corporation (President Kazuyuki Nakamura; listed on First Section of the Tokyo Stock Exchange) is beginning worldwide sales of its High-speed Modular Mounter FX-3. The FX3 is an industrial robot for mounting electronic comp
Technical Library | 2021-09-01 15:31:39.0
The long-standing trend in the electronics industry has been the miniaturization of electronic components. It is projected that this trend will continue as Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Service (EMS) providers strive to reduce "real estate" on printed circuit boards. Typically, the miniaturization of components can be achieved by integration or size reduction. At present, size reduction is considered to be more cost effective and flexible than integration. Passive components, which are used in limiting current, terminating transmission lines and de-coupling switching noise, are the primary focus in size reduction due to their variety of uses.
ETA DIP Inverted Camera Online AOI Machine ETA-V5200 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/solderplus-solder-paste
. We provide easy-to-print, robust pastes with good print definition, consistent print quality, and wide process windows. Nordson EFD’s print solder pastes provide dependable batch-to-batch consistency that can help reduce manufacturing costs by increasing first-pass yields and reducing defects, rework, and rejects
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